FAST AND LS TTL. Package Information Including Surface Mount
|
|
|
- Victoria Welch
- 5 years ago
- Views:
Transcription
1 ST S TT ackage Information Including Surface ount 7
2 IO OI SU OUT WY SU OUT? Surface ount Technology is now being utilized to offer answers to many problems that have been created in the use of insertion technology. imitations have been reached with insertion packages and board technology. Surface ount Technology offers the opportunity to continue to advance the State-of-the-rt designs that cannot be accomplished with Insertion Technology. Surface ount ackages allow more optimum device performance with the smaller Surface ount configuration. Internal lead lengths, parasitic capacitance and inductance that placed limitations on chip performance have been reduced. The lower profile of Surface ount ackages allows more boards to be utilized in a given amount of space. They are stacked closer together and utilize less total volume than insertion populated boards. rinted circuit costs are lowered with the reduction of the number of board layers required. The elimination or reduction of the number of plated through holes in the board, contribute significantly to lower board prices. Surface ount assembly does not require the preparation of components that are common on insertion technology lines. Surface ount components are sent directly to the assembly line, eliminating an intermediate step. utomatic placement equipment is available that can place Surface ount components at the rate of a few thousand per hour to hundreds of thousands of components per hour. Surface ount Technology is cost effective, allowing the manufacturer the opportunity to produce smaller units and/or offer increased functions with the same size product. SU OUT VIIITY ipolar ogic is currently offering S-TT and ST-TT in production quantities in SOI packages. efer to the following Selector uide (S366/) which indicate availability and package type for these families. These families may be ordered in rails or on Tape and eel. efer to Tape and eel information for ordering details. T T The power dissipation of surface mount packages is dependent on many factors that must be taken into consideration in the initial board design. The board material, the board surface metal thickness, pad area and the proximity to other heat generating components all have a bearing on the device dissipation capability /W θ I I SIZ 2 IS S I. 2 O T SI TI X I SIZ 8 IS 2 SO-8 SO-14 SO-16 (.090 x.110 ) T = O (.090 x.170 ) (.090 x.170 ) OW STY T T USI IIS SO TST O # , igure 2-1. Thermal esistance, unction-to-mbient ( /W) easurement specimens are solder mounted on printed circuit card 19 mm 28 mm 1.5 mm in still air. o auxiliary thermal condition aids are used. This data was collected using thermal test die in 20-pin packages on test boards (2.24 x 2.24 x.062 glass epoxy, type -4, with solder coated 1 oz./sq. ft. copper). ST S TT T 7-2
3 T ST IO OI ITT IUITS otorola has now added the convenience of Tape and eel packaging for our growing family of standard Integrated ircuit products. The packaging fully conforms to the latest I S-481 specification. The antistatic embossed tape provides a secure cavity sealed with a peel-back cover tape. I OIZTIO SOI VIS Typical View is from tape side inear direction of travel IOTIO eel Size 13 inch (330 mm) Suffix 2 Tape Width 12 mm to 24 mm (see table) Units/eel (see table) o artial eel ounts vailable and inimum ot Size is er Table OI IOTIO To order devices which are to be delivered in Tape and eel, add the suffix 2 to the device number being ordered. T 2.1 Tape and eel ata evice Type Tape Width (mm) evice/eel eel Size (inch) in ot Size er art o. Tape and eel SO , ,000 SO , ,000 SO , ,000 SO-16 Wide 16 1, ,000 SO-20 Wide 24 1, ,000 ST S TT T 7-3
4 OUTIS SOI STI (0.010) T S S -- 7 ase Suffix 14-in lastic SO (0.010) X 45 OTS: 1. ISIOS TUS T IS TU SU. 2. ISIOI TOI SI Y14.5, OTOI ISIO: IIT. 4. ISIO O OT IU O OTUSIO. 5. XIU O OTUSIO 0.15 (0.006) SI IS OSOT, W ST I IITS S S IS (0.010) T S S STI ase Suffix 16-in lastic SO (0.010) X 45 OTS: 1. ISIOI TOI SI Y14.5, OTOI ISIO: IIT. 3. ISIO O OT IU O OTUSIO. 4. XIU O OTUSIO 0.15 (0.006) SI IS OSOT, W ST I IITS S S IS (0.010) T S S 10 STI ase W Suffix 20-in lastic SO-20 (WI) 0.25 (0.010) X 45 OTS: 1. ISIOI TOI SI Y14.5, OTOI ISIO: IIT. 3. ISIO O OT IU O OTUSIO. 4. XIU O OTUSIO 0.15 (0.006) SI , -02 OSOT, W ST I IITS S S IS ST S TT T 7-4
5 OUTIS SOI (continued) ase W Suffix 24-in lastic SO-24 (WI) (0.010) OTS: 1. ISIOI TOI SI Y14.5, OTOI ISIO: IIT. 3. ISIO O OT IU O OTUSIO. 4. XIU O OTUSIO 0.15 (0.006) SI OSOT, W ST (0.010) T S S STI X 45 I IITS S S IS ST S TT T 7-5
6 -- STI OUTIS I U I-I ase Suffix 14-in eramic ual In-ine (0.010) T S 0.25 (0.010) T S OTS: 1. ISIOI TOI SI Y14.5, OTOI ISIO: I. 3. ISIO TO T O W O. 4. I Y OW TO 0.76 (0.030) W T TS T I OY TU -07 OSOT, W ST I IITS S S 1.01 IS S S ase Suffix 16-in eramic ual In-ine OTS: 1. ISIOI TOI SI Y14.5, OTOI ISIO: I. 3. ISIO TO T O W O. 4. I Y OW TO 0.76 (0.030) W T TS T I OY TU -08 OSOT, W ST STI (0.010) T S 0.25 (0.010) T S I IITS S S S IS S S S ase Suffix 20-in eramic ual In-ine OTS: 1. S WITI 0.25 mm (0.010) I., TU OSITIO T STI, T XIU TI OITIO. 2. I TO T O S W O. 3. I IUS ISUS. STI I IITS S S IS S S ST S TT T 7-6
7 OUTIS I U I-I (continued) ase Suffix 24-in eramic ual In-ine OTS: 1. ISIO TO T O S W O. 2. ISIOI TOI SI Y14.5, STI (0.010) T ISI O S I IITS S S IS ase Suffix 24-in eramic ual In-ine (WI OY) OTS: 1. I TO T O S W O. 2. S WITI 0.13 mm (0.005) IUS O TU OSITIO T STI T XIU TI OITIO. (W O ) STI I IITS S S 1.27 IS S S ase Suffix 48-in eramic ual In-ine (0.010) T 0.25 (0.010) T STI OTS: 1. ISIOI TOI SI Y14.5, OTOI ISIO: I. 3. I TO T O W O. I IITS S S S IS S S S ST S TT T 7-7
8 OUTIS STI OT 4 STI ase Suffix 14-in lastic OTS: 1. S WITI 0.13 mm (0.005) IUS O TU OSITIO T STI T XIU TI OITIO. 2. ISIO TO T O S W O. 3. ISIO OS OT IU O S. 4. OU OS OTIO OSOT, W ST I IITS S S IS S S ase Suffix 16-in lastic OTS: 1. ISIOI TOI SI Y14.5, OTOI ISIO: I. 3. ISIO TO T O S W O. 4. ISIO OS OT IU O S. 5. OU OS OTIO TU -07 OSOT, W ST S 0.25 (0.010) T STI I S IITS S 1.27 S IS S S (0.010) T STI ase Suffix 20-in lastic (0.010) T OTS: 1. ISIOI TOI SI Y14.5, OTOI ISIO: I. 3. ISIO TO T O W O. 4. ISIO OS OT IU O S OSOT, W ST I IITS S S S 1.01 IS S S S ST S TT T 7-8
9 OUTIS STI (continued) -- STI (0.010) T ase Suffix 24-in lastic 24 OT (0.010) T OTS: 1. OTOU OTIO. 2. I TO T O S W O. 3. ISIOS TOS SI Y14.5, OTOI ISIO: I. I IITS S S S 1.01 IS S S S Q 24 STI ase Suffix 24-in lastic Wide ody OTS: 1. S WITI 0.13 mm (0.005) IUS O TU OSITIO T STI T XIU TI OITIO. 2. ISIO TO T O S W O OSOT, W ST S ISSU O. I Q IITS IS S S ase Suffix 40-in lastic OTS: 1. OSITIO TO O S (), S WITI 0.25 mm (0.010) T XIU TI OITIO, I TIO TO STI OT. 2. ISIO TO T O S W O. 3. ISIO OS OT IU O S STI I IITS S S 1.02 IS S S ST S TT T 7-9
10 OUTIS STI (continued) ase Suffix 48-in lastic -- STI () T S TI X (0.010) T TI T TI X S 48 OTS: 1. ISIOS TOI SI Y14.5, OTOI ISIO: I. 3. ISIO TO T O W O. 4. ISIOS O OT IU O S. XIU O S 0.25 (0.010) OSOT. W ST I IITS IS S S 1.79 S S S S 1.01 ST S TT T 7-10
11 OUTIS ase Suffix 20-in lastic -- Y 0.18 (0.007) T S S S S U 0.18 (0.007) T S S S S W Z V X VIW (0.010) T S S S S 0.18 (0.007) T S S S S Z 0.18 (0.007) T S S S S 0.18 (0.007) T S S S S 0.18 (0.007) T S S S S (0.010) S T S S S S 0.10 (0.004) STI TI S TI S 0.18 (0.007) T S S S S 0.18 (0.007) T S S S S I U V W X Y Z 1 1 Z1 IITS IS S S OTS: 1. TUS --, --, --, -- TI W TO O SOU XIT STI OY T O TI I. 2. I I, TU OSITIO TO SU T TU, STI. 3. I U O OT IU O OTUSIO. OW O OTUSIO IS 0.25 (0.010) SI. 4. ISIOI TOI SI Y14.5, OTOI ISIO: I IS OSOT, W ST ST S TT T 7-11
12 OUTIS (continued) ase Suffix 28-in lastic -- Y 0.18 (0.007) T S S S S U 0.18 (0.007) T S S S S S TU W Z V X VIW (0.010) T S S S S 0.18 (0.007) T S S S S Z 0.18 (0.007) T S S S S 0.18 (0.007) T S S S S 0.18 (0.007) T S S S S 1 TI S 0.25 (0.010) S T S S S S 0.10 (0.004) STI 1 TI S 0.18 (0.007) T S S S S 0.18 (0.007) T S S S S I U V W X Y Z 1 1 Z1 IITS IS S S OTS: 1. U TO S IITTIO, S S ST Y (S) S OUTI WI T T SOWI 28 S. 2. TUS --, --, --, -- TI W TO O SOU XIT STI OY T O TI I. 3. I 1, TU OSITIO TO SU T TU, STI. 4. I U O OT IU O OTUSIO. OW O OTUSIO IS 0.25 (0.010) SI. 5. ISIOI TOI SI Y14.5, OTOI ISIO: I IS OSOT, W ST ST S TT T 7-12
13 OUTIS (continued) ase Suffix 68-in lastic -- Y 0.18 (0.007) T S S S S U 0.18 (0.007) T S S S S S TU -- W Z V X VIW (0.010) T S S S S 0.18 (0.007) T S S S S Z 0.18 (0.007) T S S S S 0.18 (0.007) T S S S S 0.18 (0.007) T S S S S 1 TI S 0.25 (0.010) S T S S S S 0.10 (0.004) STI 1 TI S 0.18 (0.007) T S S S S 0.18 (0.007) T S S S S I U V W X Y Z 1 1 Z1 IITS IS S S OTS: 1. U TO S IITTIO, S S ST Y (S) S OUTI WI T T SOWI 68 S. 2. TUS --, --, --, -- TI W TO O SOU XIT STI OY T O TI I. 3. I 1, TU OSITIO TO SU T TU, STI. 4. I U O OT IU O OTUSIO. OW O OTUSIO IS 0.25 (0.010) SI. 5. ISIOI TOI SI Y14.5, OTOI ISIO: I IS OSOT, W ST ST S TT T 7-13
14 ST S TT T 7-14
OSU GOSS STADIUM - RIGHT FIELD BALCONY AND OMAHA ROOM RENOVATION OREGON STATE UNIVERSITY FINAL CONSTRUCTION DOCUMENTS
0 UI II OTS SYO V. SITIO I OTTIO II: I SI SUY UI II: TW W W W TW W OT O WT OT OT WT OT OT WT TU OT T OT WT O-OT O WT SITY WST SYO () O dia - -0-0 VITIO O TI U ST U STIO TT ST U XISTI IT SITIO W TO XISTI
MT3421. Absolute Maximum Ratings(TA =25. General Description. Features. Thermal Characteristics
General Description Features D G SOT-23 S Absolute Maximum Ratings(TA =25 unless otherwise noted) Symbol Parameter Ratings Units Thermal Characteristics Package Marking and Ordering Information Device
Type FCA Acrylic Surface Mount Film Capacitors
Acrylic Stacked Metallized Film Capacitors for Filtering and Noise Attenuation Type FCA acrylic flm chips are non-inductive stacked metallized film capacitors which feature large capacitance values in
SOT23 3. Part Number Compliance Marking Reel Size(inches) Tape Width(mm) Quantity Per Reel DESDA5V3LQ-7 Automotive RD ,000/Tape & Reel
YM YW 5V3Q F M V Y roduct ummary V BMin) Max) Max) 5.3V 2 22pF escription his new generation V is designed to protect sensitive electronics from the damage due to. he combination of small size and high
MH Series High Current Chip Ferrite Beads
*ohs COMPLIANT & **HALOGEN FEE Features High resistance to heat and humidity esistance to mechanical shock and pressure Accurate dimensions for automatic surface mounting Wide impedance range ohs compliant*
High Stability - High Temperature (230 C) Thin Film Wraparound Chip Resistors
High Stability - High Temperature (230 C) Thin Film Wraparound Chip Resistors INTRODUCTION For applications such as down hole applications, the need for parts able to withstand very severe conditions (temperature
AEROSPACE PRODUCT LINE PACKAGE BROCHURE
AROSPAC PRODUCT LIN PACKAG BROCHUR For general information on Analog Devices Space Qualified products please visit the following address. http://www.analog.com/aerospace For technical inquiries on Aerospace
RDP-272+ DC to 2700 MHz (DC-950, MHz) The Big Deal Low insertion loss High isolation Miniature shielded package.
Surface Mount Diplexer 5Ω DC to 27 MHz (DC-95, 17-27 MHz) The Big Deal Low insertion loss High isolation Miniature shielded package CASE STYLE: CK65 Product Overview is a low-pass + high-pass combination
Insertion loss (db) TOP VIEW SIDE VIEW BOTTOM VIEW. 4x ± ± Orientation Marker Denotes Pin Location 4x 0.
Model DC4759J52AHF Ultra Low Profile 85 2dB Directional Coupler Description The DC4759J52AHF is a low cost, low profile sub-miniature high performance 2 db directional coupler in an easy to use RoH compliant,
Top View BAS70WQ BAS70W-04Q BAS70W-05Q BAS70W-06Q
SUC MOU SCHOKY BI DIOD Product Summary V M (V) I O (m) V (MX) @ 1m (V) I (MX) @ V = 50V (μ) 70 70 0.41 0.1 pplications SMPS DC-DC Converter reewheeling Diodes everse Polarity Protection Blocking Diodes
± 0.2 ppm/ C ± 3 ppm/ C. ± 2.0 ppm/ C
Models # 303119Z and 303119 (Current Sensing Fixed Foil Resistor Chips VCS1625Z/VCS1625 Configuration) Screen/Test Flow in Compliance with EEE-INST-002, (Tables 2A and 3A, Film/Foil, Level 1) and MIL-PRF-55342
SOT-23 Single Op Amp Evaluation Board User Guide UG-838
SOT-23 Single Op Amp Evaluation Board User Guide One Technology Way P.O. Box 9106 Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 www.analog.com Evaluation Board for Single, High Speed
SC-70 Evaluation Board User Guide UG-112
SC-70 Evaluation Board User Guide UG-112 One Technology Way P.O. Box 9106 Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 www.analog.com Evaluation Board for Single, High Speed Op Amps
Evaluation Board User Guide UG-129
Evaluation Board User Guide UG-129 One Technology Way P.O. Box 9106 Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 www.analog.com Universal Evaluation Board for Dual High Speed Op Amps
50 V, 3 A PNP low VCEsat (BISS) transistor
Rev. 6 28 June 2011 Product data sheet 1. Product profile 1.1 General description PNP low V CEsat Breakthrough In Small Signal (BISS) transistor in a small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic
BAT54 series 1. Product profile 2. Pinning information Schottky barrier diodes 1.1 General description 1.2 Features and benefits
SOT2 Rev. 5 5 October 2012 1. Product profile 1.1 General description Planar with an integrated guard ring for stress protection, encapsulated in a small SOT2 (TO-26AB) Surface-Mounted Device (SMD) plastic
Lightstream Scroll kW ULTRACOMPACT II COMPACT AIR-COOLED CHILLERS WITH SCROLL COMPRESSORS
Lightstream Scroll ULTRACOMPACT II COMPACT AIR-COOLED CHILLERS WITH SCROLL COMPRESSORS EXTREME EFFICIENCY WITH EER UP TO 3.29 OPTIONAL EVAPORATIVE PRE-COOLING MICROCHANNEL CONDENSING COILS COMPACT & LIGHTWEIGHT
Commercial Thin Film Resistor, Surface Mount Chip
P-NS Commercial Thin Film Resistor, Surface Mount Chip For applications requiring low noise, stability, low temperature coefficient of resistance, and low voltage coefficient, all Vishay s proven precision
SYMBOL TYPE NUMBER VALUE UNIT. Power dissipation at Tamb = 60 ºC 1.5 W. Non repetitive peak zener dissipation (t = 10ms) 40 W
DO-204AL (DO-41) Voltage Power Dissipation 10 to 200 V 1.5 W Maximum Ratings and Electrical Characteristics at 25 C FEATURE Glass passivated chip junction Hiperectifier structure for high reliability Cavity-free
Policy E-06: Added (c) to reflect policy (no change). April 1, 2013 Policy E-09: Added more information to reflect changes in QFR process.
Alberta Health Alberta Aids to Daily Living Stationary Commodes, Mattress Overlays, Transfer Pole-Aids and Transfer Bed Rails Benefits Policy & Procedures Manual July 1, 2013 Transfer Bed Rails Benefits,
Multilayer Ceramic Chip Capacitor
.. Features -Wide capacitance range, extremely compost size -Low inductance of capacitor for high frequency application -Excellent solderability and resistance to soldering heat, suitable for flow and
DUAL SCHOTTKY DIODE BRIDGE
UC1610 UC3610 DUAL SCHOTTKY DIODE BRIDGE SLUS339B JUNE 1993 REVISED DECEMBER 2004 FEATURES Monolithic Eight-Diode Array Exceptional Efficiency Low Forward Voltage Fast Recovery Time High Peak Current Small
3M CF Card Header CompactFlash Type II, Long Guides, Surfacemount
CF Card Header Headers mate with both CompactFlash Type I and Type II cards Polarization options for top or bottom boardmount Extended guide rails enable accurate and easy card insertion Metal brace provides
SOT Package summary
1. Package summary Table 1. Package summary plastic, leadless thermal enhanced ultra thin small outline package; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 8 June 2018 Package information Terminal
Power dissipation comparable to SOT23 Package height typ mm AEC-Q101 qualified
Rev. 1 12 October 2017 Preliminary data sheet 1 Product profile 1.1 General description General-purpose Zener diode, encapsulated in an SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic
AC Line Rated Ceramic Disc Capacitors Class X1, 400 V AC / Class Y4, 125 V AC
AC Line Rated Ceramic Disc Capacitors Class X1, V AC / Class Y4, 125 V AC FEATURES Complying with IEC 6384-14 3 rd edition High reliability Complete range of capacitance values Radial leads Singlelayer
NPIS Shielded Power Inductors
FEATURES SHIELDED POWER INDUCTOR HIGH CURRENT (UP TO 19.9 AMPS) SURFACE MOUNTABLE CONSTRUCTION HIGH INDUCTANCE (UP TO 3,300µH) TAPED AND REELED FOR AUTOMATIC INSERTION FOR USE IN DC/DC CONVERTERS CHARACTERISTICS
HARDWARE & ACCESSORIES
HARDWARE & ACCESSORIES NTE Type Number Diagram Number Quantity Per Pkg SEMICONDUCTOR HEAT SINKS NTE400 362 2 Heat Sink for TO5/TO39 Type Package NTE401 352 2 Heat Sink for TO5/TO39 Type Package NTE402
3M D Sub EMI Junction Shell Shielded Flat Cable
3M D Sub EMI Junction Shell Shielded Flat Cable Stainless steel inserts in plastic shell provide EMI/ ESD protection for shielded flat cable Uses standard hardware Light weight, compact size Low profile
To request a full data sheet, please send an to:
To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins
FrelTec. Switching Diode 0603
Mathildenstr. 10A 82319 Starnberg Germany Switching Diode 0603 6/1/2018 1/10 FrelTec GmbH www.freltec.com SPECIFICATION 613 CD4148WTPx 0603 E05 Type Type Package Packing 613: SWITCHING DIODE All products
AC Line Rated Ceramic Disc Capacitors Class X1, 760 V AC / Class Y1, 500 V AC
4L Series AC Line Rated Ceramic Disc Capacitors Class X, 76 V AC / Class Y, 5 V AC FEATURES Complies with IEC 6384-4, 4 th edition High reliability Radial leads High capacitance up to nf Singlelayer AC
description/ordering information
SCLS079E MARCH 1984 REVISED MARCH 2004 Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 20-µA Max I CC Typical t pd = 7 ns ±4-mA Output Drive at
THE PROXIMITY OF MICROVIAS TO PTHs AND ITS IMPACT ON THE RELIABILITY
THE PROXIMITY OF MICROVIAS TO s AND ITS IMPACT ON THE RELIABILITY Anthony Primavera Manager - CSP Consortium Universal Instruments Corporation Binghamton, New York 13902-0825. Jaydutt Joshi Package Development
GHz GaAs MMIC Transmitter
.. GHz GaAs MMIC July Rev Jul Features Subharmonic Integrated Mixer, LO Doubler/Buffer & Output Amplifier +. dbm Output Third Order Intercept (OIP). db Gain Control. dbm LO Drive Level. db Conversion Gain
182. PROFILE ON THE PRODUCTION OF PRINTED CIRCUIT BOARD
182. PROFILE ON THE PRODUCTION OF PRINTED CIRCUIT BOARD 182-1 TABLE OF CONTENTS PAGE I. SUMMARY 182-2 II. PRODUCT DESCRIPTION & APPLICATION 182-3 III. MARKET STUDY AND PLANT CAPACITY 182-3 A. MARKET STUDY
Q&A Distribution equipment and materials
Q&A Distribution equipment and materials ITB-223/17 Establishing Long Term Agreement (LTA) in Two Lots for purchasing various capacities Transformers and Electricity supplies under Funding Facility for
S af e H ar b o r N o t ic e We have made forward-l ook i n g s t at emen t s i n t he p res en t at i on. O u r forwardl ook i n g s t at emen t s c
O Qisda C o r p o r at io n 2 0 1 2 Q1 R e su l t s April 26, 2012 u t l in e 2012 Q1 Financial Results 2012 Q1 B usiness S um m ar y 2 1 S af e H ar b o r N o t ic e We have made forward-l ook i n g s
For a detailed datasheet and other design support tools, please contact
This device is designed specifically to power Intel processors under a strict disclosure agreement with Intel Corporation. The end user must have a current CNDA in place with Intel Corporation to access
High Reliability Glass Epoxy Multi-layer Materials
Data Sheet High Reliability Glass Epoxy Multi-layer Materials Laminate R-1755C Prepreg R-1650C Jun. 2017 No.17061939 Specification / Laminate R-1755C No.; 17061939-1 Property Units Test Method Condition
ROSEMOUNT 4088 MULTIVARIABLE TRANSMITTER COPLANAR FLANGE PROCESS CONNECTION
1 2 3 4 5 7 9 8 11 10 12 14 13 ROSOUNT 4088 UTIVRI TRNSITTR OPNR N PROSS ONNTION 15 1 RVISION T RVISION O NO. PP' T RT108827 T. UO SRIPTION XTN OVR. PNTW OUSIN SOWN WIT OPTION IIT ISPY PNTW OUSIN 5.17
IMPROVED PRODUCT VCS331, VCS332
Bulk Metal Foil Technology High Precision 4-Terminal Power Current Sensing Resistors with TCR as low as ± 1 ppm/ C Maximum, Tolerance ± 0.1 % and Rise Time 1.0 ns Effectively No Ringing INTRODUCTION The
LOW TEMPERATURE COFIRED CERAMIC DESIGN GUIDELINES
LOW TEMPERATURE COFIRED CERAMIC DESIGN GUIDELINES D E S I G N G U I D E NATEL ENGINEERING 6350 PALOMAR OAKS CT. CARLSBAD, CA 92011 760-448-1500 UNPUBLISHED WORK ALL RIGHTS RESERVED This design guide is
g g g g 4.5 SPRINKLER DESIGN SCHEDULE (REFERENCE SPECIFICATION SECTION[S]) SPKR. SPACING (SQ. FT.) SYSTEM NO.
![g g g g 4.5 SPRINKLER DESIGN SCHEDULE (REFERENCE SPECIFICATION SECTION[S]) SPKR. SPACING (SQ. FT.) SYSTEM NO.](/thumbs/91/106506508.jpg "g g g g 4.5 SPRINKLER DESIGN SCHEDULE (REFERENCE SPECIFICATION SECTION[S]) SPKR. SPACING (SQ. FT.) SYSTEM NO.")
X O I (Y). I OO OI O O OIIO OOIIO O OIO O I I WI Y I O OIO O I.. IO O O OIO, I OO OY OOI WI O II, II O,, I,, I, OI, I I O W I O I WI O O I I OOII I O I O.. O IIZ I IIYI I OIO I IO O. Y OIO I III I O O
Case Material: Molded Plastic. UL Flammability Classification Low Reverse Leakage Current
Pb 4A GLASS PASSIVATED BRIDGE RECTIFIER Features Mechanical Data Glass Passivated Die Construction Case: Rating to 1,000V PRV Case Material: Molded Plastic. UL Flammability Classification Low Reverse Leakage
Data Sheet High Reliability Glass Epoxy Multi-layer Materials (High Tg & Low CTE type) Laminate R-1755V Prepreg R-1650V
Data Sheet High Reliability Glass Epoxy Multi-layer Materials (High Tg & Low CTE type) Laminate R-1755V Prepreg R-1650V Jun. 2017 No.17061636 Specification / Laminate R-1755V No.; 17061636-1 Property Units
16 REVISION TABLE ROSEMOUNT 4088 IN-LINE PRESSURE TRANSMITTER 1/2-14 NPT FEMALE PROCESS CONNECTION DATE A CONDUIT CONNECTION (2 PLACES) (THIS SIDE)
0 [] RVISION T ROSOUNT 0 IN-IN PRSSUR TRNSITTR /- NPT PROSS ONNTION RVISION O NO. PP' T RT00 T. UO // SRIPTION XTN OVR STINSS ST PROSS WTT SOWN WIT OPTION IIT ISPY. [] RTIITION ONUIT ONNTION ( PS) OY -
µmodule LGA Level 2 Interconnect Reliability Data
µmodule LGA Level 2 Interconnect Reliability Data CONTENTS August 2011 Demo Board Details.....2 Demo Board Reliability Results.....3, 4 Rider Card Details....5 Rider Card Reliability Results........6 Daisy
SERIES 2000 STICK ANTENNA
Not Recommended for New designs RI-ANT-S01C, RI-ANT-S02C SERIES 2000 STICK ANTENNA SCBS851 DECEMBER 2002 REVISED DECEMBER 2005 FEATURES Best in Class Performance Through Patented HDX Technology IP 64+
OBSOLETE. Features. Mechanical Data PNP PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTOR
PNP PRE-BIASED SMALL SIGNAL SURFAE MOUNT TRANSISTOR Obsolete Part Number Alternative Part Number DDTA4EA DDTA5EA DDTA3EA DDTA4EA DDTA43EA DDTA44EA Features Epitaxial Planar Die onstruction omplementary
3M HDC Header.100 Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit HDC Series
M HDC Header High density, up to 240 contacts single bay and 66 contacts dual bay Early Mate Late Break (EMLB) grounding contacts for hot swapping Mates with three-row and four-row sockets See Regulatory
APPENDIX J - Wiring Diagram, FSD
I - iring iagram, O I/I 0 0 O 3 I I 00/00 I 430 400 I 30 00 -- I 3 O 3 4 3 I II O OOI -00 3 3 O 3 O 3 I 3 I 3 O IO I O 00 in should e grounded when there is no indicator installed IO I IO 4 IO I IO 3 O
THE PROXIMITY OF MICROVIAS TO PTHs AND ITS IMPACT ON THE RELIABILITY OF THESE MICROVIAS
THE PROXIMITY OF MICROVIAS TO PTHs AND ITS IMPACT ON THE RELIABILITY OF THESE MICROVIAS Jaydutt Joshi Principle Program Manager RF Module Technology Development Skyworks Solutions, Inc. Irvine, California
Type 778P/779P, Orange Drop, Polypropylene Film/Foil Capacitors
Type 778P/779P Orange Drop 400 Volts A-C Polypropylene Film/Foil Capacitors Features Specifically designed for A-C voltage applications where corona free operation is required for high reliability. Extremely
Power Resistors Cooled by Auxiliary Heatsink (Not Supplied) Thick Film Technology
Power Resistors Cooled by Auxiliary Heatsink (Not Supplied) Thick Film Technology FEATURES System without external radiation High power / volume ratio Non-inductive Screw-on outputs Possible configuration
Recommended Land Pattern: [mm]
![Recommended Land Pattern: [mm]](/thumbs/73/68316164.jpg "Recommended Land Pattern: [mm]")
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. 3 Inductance 10 khz/ 0.1 ma L. mh ±30% 1 4 Rated Current @ 70 C I R.75 A max. DC Resistance
Data sheet acquired from Harris Semiconductor SCHS018C Revised September 2003
Data sheet acquired from Harris Semiconductor SCHS018C Revised September 2003 The CD4007UB types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic
Data sheet acquired from Harris Semiconductor SCHS044C Revised September 2003
Data sheet acquired from Harris Semiconductor SCHS044C Revised September 2003 The CD4047B-Series types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line
3M Mini Serial Attached SCSI (minisas) Connector Assembly Internal Right Angle Combo Connector
M Mini Serial Attached SCSI (minisas) Connector Assembly 8AB6 Series Capable of 6 Gbps per channel data rate Combination receptacle/shell assembly to facilitate board assembly Available with pre-positioning
SN54F10, SN74F10 TRIPLE 3-INPUT POSITIVE-NAND GATES
SN54F10, SN74F10 TRIPLE 3-INPUT POSITIVE-NAND GATES SDFS039A MARCH 1987 REVISED OCTOBER 1993 Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic
Solid-Electrolyte TANTALEX Capacitors Hermetically-Sealed, Axial-Lead FEATURES Terminations: Tin/lead (SnPb), 100 % Tin (RoHS compliant)
FEATURES Terminations: Tin/lead (SnPb), 100 % Tin (RoHS compliant) PERFORMANCE CHARACTERISTICS Operating Temperature: - 55 C to + 85 C (To + 125 C with voltage derating) Capacitance Tolerance: At 120 Hz,
... Data sheet acquired from Harris Semiconductor SCHS115D Revised September Copyright 2003 Texas Instruments Incorporated
Data sheet acquired from Harris Semiconductor SCHS115D Revised September 2003 The CD4093B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic
2o1 1. annual REPORT ENABLING A MICROELECTRONIC WORLD
2o1 1 annual REPORT ENABLING A MICROELECTRONIC WORLD SERVING INDUSTRY FOR OVER 40 YEARS Amkor is one of the world s largest providers of contract semiconductor assembly and test services. Founded in 1968,
13 Combinational Logic Devices
Prof. r. J. Reichardt Prof. r.. Schwarz F Elektrotechnik/Informatik ombinational ogic evices Purpose of combinational logic design: uilding larger, more sophisticated logic circuits by using adaptable
3M DIN C-Form Plug.100 Standard Mount, Right Angle, Solder Tail Termination DIN Series
Standard Mount, Right Angle, Solder Tail Termination DIN 41612 Series Multi-pin count socket for VME, VXI and Multibus II daughter cards Early mate late break (EMLB) grounding contacts for hot swapping
Data sheet acquired from Harris Semiconductor SCHS052B Revised June 2003
Data sheet acquired from Harris Semiconductor SCHS052B Revised June 2003 The CD4067B and CD4097B types are supplied in 24-lead hermetic dual-in-line ceramic packages (F3A suffix), 24-lead dual-in-line
HEQEP CP- 213 Department of Biochemistry and Molecular Biology, University of Dhaka. Request for quotation For Package number: G14
HEQEP CP- 213 Department of Biochemistry and Molecular Biology, University of Dhaka Request for quotation For Package number: G14 Name of the Package: Supply of Supply Cell Culture Accessories RFQ No:
SOT Package summary. plastic, single ended surface mounted package (LFPAK56D); 8 leads 8 October 2018 Package information
plastic, single ended surface mounted package (LFPK56D); 8 leads 8 October 2018 Package information 1. Package summary Terminal position code Package type descriptive code Package type industry code Package
Low Profile, High Current IHLP Inductors
ow Profile, High Current IHP Inductors Manufactured under one or more of the following: US Patents; 6,198,375/6,4,744/6,449,829/6,4,244. Several foreign patents, and other patents pending. STANDARD EECTRICA
Reinforced Winding Wirewound Power Resistor
Reinforced Winding Wirewound Power Resistor FEATURES Very high dissipation High energy absorption and high overloads Suitable for the most severe conditions Material categorization: for definitions of
S af e H arb or N otic e We have made forward-l ook i n g s t at emen t s i n t he p res en t at i on. O u r forwardl ook i n g s t at emen t s c on t
O Qisda Corporation 2 0 1 2 Q3 R e su l ts October 26, 2012 u tl ine 2012 Q3 Financial Results 2012 Q3 B usiness S um m ar y 2 1 S af e H arb or N otic e We have made forward-l ook i n g s t at emen t
PACKAGE OPTION ADDENDUM
PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp
K BAND SUPER LOW NOISE AMPLIFIER N-CHANNEL HJ-FET. Drop-In Replacement: CE3520K3. Part Number Order Number Package Quantity Marking Supplying Form
FEATURES Super low noise figure and high associated gain HETERO JUNCTION FIELD EFFECT TRANSISTOR K BAND SUPER LOW NOISE AMPLIFIER N-CHANNEL HJ-FET NF = 0.75 db TYP., Ga = 10 db TYP. @ f = 20 GHz Micro-X
Monolithic Amplifier CMA-162LN+ Ultra Low Noise, High IP to 1.6 GHz
Ultra Low Noise, High IP3 Monolithic Amplifier 50Ω 0.7 to 1.6 GHz The Big Deal Ceramic, Hermetically Sealed, Nitrogen filled Low profile case,.045 high Ultra Low Noise Figure, 0.5 db High Gain, High IP3
Lightstream Scroll kW AIR-COOLED CHILLERS WITH SCROLL COMPRESSORS
IR-COOLED CHILLERS WITH SCROLL COMPRESSORS CLSS ENERGY EFFICIENCY MICROCHNNEL CONDENSING COILS HET RECOVERY OPTIONS 190-0 VILBLE IN 7 FRME SIZES, TOTL MODELS WITH WIDE SELECTION OF OPTIONS ND CCESSORIES
City of Newnan, Georgia
City of Newnan, Georgia Invitation to Bid Mill & Resurfacing of Various Streets- 2017 Issue Date: May 25, 2017 Issued By: Inquiries: Proposals Due: Bid Opening: City of Newnan Public Works Department 25
3M Mini D Ribbon (MDR) Connectors.050 Boardmount Through-Hole Rt. Angle Receptacle Shielded, SCSI-2 Layout 102 Series
Wiper-on-wiper contact for reliable repetitive plugging Rugged die cast metal case construction Ground lock for reliable PCB retention Interface latch design for connection stability 68 contacts Reverse
BID RESPONSE LABEL THIS LABEL FOR USE WITH UNITED STATES POSTAL SERVICE DELIVERY PURCHASE OF SIGNS AND SIGN ACCESSORIES (DATE): NOV.
BID RESPONSE LABEL Proposals sent by U.S. Mail should be addressed to Director of General Services, Town of Manchester, 494 Main Street, P.O. Box 191, Manchester, CT 06045-0191. Proposals hand delivered
Bulk Metal Foil Hermetically sealed, Small Package, Voltage Dividers with TCR Tracking of 0.1 ppm/ C and Tolerance Match down to 0.
Bulk Metal Foil Hermetically sealed, Small Package, Voltage Dividers with TCR Tracking of 0.1 ppm/ C and Tolerance Match down to 0.001 % Any value at any ratio available within resistance range Models
SN54LS11, SN54S11, SN74LS11, SN74S11 TRIPLE 3-INPUT POSITIVE-AND GATES
SN54LS11, SN54S11, SN74LS11, SN74S11 TRIPLE 3-INPUT POSITIVE-AND GATES SDLS131 APRIL 1985 REVISED MARCH 1988 PRODUCTION DATA information is current as of publication date. Products conform to specifications
FEATURES [31.750] Min.
![FEATURES [31.750] Min.](/thumbs/89/100571049.jpg "FEATURES [31.750] Min.")
Polyester Film/Foil Capacitors Sleeved, Miniature, Axial ead FEATURES Axial lead, designed for automatic insertion Non-inductively wound, extended foil construction ead wire has metal end cap for connection
3M Pin Strip Header.100 and Straight and Right Angle, Solder Tail 2300 Series
and Straight and Right Angle, Solder Tail 2300 Series One and two row versions Straight and right angle versions Tin lead or gold plating available Tapered tip does not cut the socket wipe during insertion,
R-407C REFRIGERANT LORC, LNH, LNL, LNQ AND LNX SERIES OUTDOOR AIR-COOLED REMOTE CONDENSERS STANDARD FEATURES VERTICAL DISCHARGE
R-407C REFRIGERANT OUTDOOR AIR-COOLED REMOTE CONDENSERS STANDARD FEATURES VERTICAL DISCHARGE WEATHER-TIGHT ELECTRICAL ENCLOSURE COMPUTER DESIGNED CONDENSER COILS FULL-FLOODING SYSTEM (-20 F CAPABILITY)
P36 SERIES ROTARY DIP SWITCHES
P36 SERIES ROTARY DIP SWITHES FEATURES Improved temperature withstanding. ompletely sealed for process compatibility. or 6 positions. Precision designed detent action. Ultra compact size through hole and
Monolithic Amplifier CMA-84+ Wideband, High Dynamic Range, Ceramic. DC to 7 GHz. The Big Deal
Wideband, High Dynamic Range, Ceramic Monolithic Amplifier Ω DC to 7 GHz The Big Deal Ceramic, hermetically sealed, nitrogen filled Low profile case,.4 High IP3, +38 dbm High Gain, 24 db High POUT, +21
SN54LS266, SN74LS266 QUADRUPLE 2-INPUT EXCLUSIVE-NOR GATES WITH OPEN-COLLECTOR OUTPUTS
SN54LS266, SN74LS266 QUADRUPLE 2-INPUT EXCLUSIVE-NOR GATES WITH OPEN-COLLECTOR OUTPUTS SDLS151 DECEMBER 1972 REVISED MARCH 1988 PRODUCTION DATA information is current as of publication date. Products conform
PACKAGE OPTION ADDENDUM
PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp
PACKAGE OPTION ADDENDUM
PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp
3M Pak 50 Low Profile Plug.050" Plug, (1.27) Straight, Right Angle and SMT, Low Profile P50LE Series
M Pak 50 Low Profile Plug Latch/eject mechanism maintains a secure connection Low profile 11.8 mm mated height when using the surfacemount version Mates to the P25LE wiremount socket RoHS Compliant. See
Configurations: Dimension (mm) IMCG ± ± ± ± IMCG ± ± ± ±
Chip s Multilayer Chip s For General Configurations: FEATURES To prevent EMI interference noises between. High Q and high reliability and ferrite material. Bead inductor for power energy storage or noise
SRP5030CA Series Shielded Power Inductors
*RoHS COMPLIANT, **HALOGEN FREE & AEC-Q2 COMPLIANT 1726 Features Shielded construction Metal alloy powder core High saturation current Flat wire AEC-Q2 compliant RoHS compliant* and halogen free** SRP53CA
SCALE TYP 0.08 SEATING PLANE
420227/C SCALE 4.000 PACKAGE OUTLINE DBZ000A SOT-2 -.2 mm max height 2.64 2.0 C PIN INDEX AREA.4.2 B A.2 MAX 0. C 0.95.9.04 2.80 X 0.5 2 0. 0.2 C A B (0.95) 0.0 0.0 0.25 GAGE PLANE 0.20 0.08 0-8 0.6 0.2
Solid-Electrolyte TANTALEX Capacitors, Hermetically-Sealed, Axial-Lead
Solid-Electrolyte TANTALEX Capacitors, Hermetically-Sealed, Axial-Lead PERFORMANCE CHARACTERISTICS Operating Temperature: -55 C to +125 C (above 85 C, voltage derating is required) Capacitance Tolerance:
PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp
SN5451, SN54LS51, SN54S51 SN7451, SN74LS51, SN74S51 AND-OR-INVERT GATES
SN5451, SN54LS51, SN54S51 SN7451, SN74LS51, SN74S51 AND-OR-INVERT GATES SDLS113 DECEMBER 1983 REVISED MARCH 1988 PRODUCTION DATA information is current as of publication date. Products conform to specifications
WARRANTY TERMS & CONDITIONS
WARRANTY TERMS & CONDITIONS Eurotronics corporate policy is to provide its Customers with high quality Products meeting or exceeding agreed-upon customer specifications. 1. Definitions The Products supplied
CD4071B Quad 2-Input OR Gate CD4072B Dual 4-Input OR Gate CD4075B Triple 3-Input OR Gate
Data sheet acquired from Harris Semiconductor SCHS056D Revised August 2003 CD4071B Quad 2-Input OR Gate CD4072B Dual 4-Input OR Gate CD4075B Triple 3-Input OR Gate CD4071B, CD4072B, and CD4075B OR gates
e-tender Providing and fixing Modular Partition & Roller curtain Important Information: BID FORM for Procurement of
Date: 21/06/2014 Reference Number: IITRAM/PUR/2014/289 e-tender BID FORM for Procurement of Providing and fixing Modular Partition & Roller curtain Important Information: Date of issue 21/06/2014 e-tender
SN5486, SN54LS86A, SN54S86 SN7486, SN74LS86A, SN74S86 QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES
OBSOLETE - No Longer Available SN5486, SN54LS86A, SN54S86 SN7486, SN74LS86A, SN74S86 QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES SDLS124 DECEMBER 1972 REVISED MARCH 1988 PRODUCTION DATA information is current
UNITED STATES CUSTOMS COUNTRY OF ORIGIN MARKING RULES IMPORTED FRAMES AND LENSES FOR FOR USE BY IMPORTERS OF OPTICAL PRODUCTS
UNITED STATES CUSTOMS COUNTRY OF ORIGIN MARKING RULES FOR IMPORTED FRAMES AND LENSES FOR USE BY IMPORTERS OF OPTICAL PRODUCTS PREPARED BY: JAMES E. ANDERSON VCA LEGAL COUNSEL HOWE, ANDERSON & STEYER, PC