µmodule LGA Level 2 Interconnect Reliability Data
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1 µmodule LGA Level 2 Interconnect Reliability Data CONTENTS August 2011 Demo Board Details Demo Board Reliability Results.....3, 4 Rider Card Details....5 Rider Card Reliability Results Daisy Chain Board Details....7 Daisy Chain Board Reliability Results
2 LTC Demo Board Details PCB Material FR-4 # Metal Layers 2 Board Size 4 3/4" x 3" Thickness 62 mils or 93 mils (see details) Pad Type NSMD Pad Finish NiAu Pad Size 0.635mm Soldermask opening 0.686mm Soldermask thickness mm Method for Detecting Interconnect Failure Bench set-up, Functional test Page 2
3 DEMO BOARD MOUNT TEMP CYCLE DATA FOR THE LTM46XX FAMILY (15mmX15mm) BOARD THICKNESS BENCH 0513 LTM4600 LGA mils , ,000 SnPb 0525 LTM4600 LGA mils , ,000 SnPb 0546 LTM4600 LGA mils , ,000 SnAgCu 0623 LTM4601 LGA mils , ,000 SnAgCu 0738 LTM4616 LGA mils , ,000 SnAgCu 0846 LTM4617 LGA mils , ,500 SnAgCu 6 LOTS ,059,500 * 10 C per minute ramp rate * 10 minute dwell time 0 C +100 C 0 C +100 C BOARD THICKNESS BENCH 0715 LTM4600 LGA mils , ,000 SnAgCu 0632 LTM4601 LGA mils , ,000 SnPb 2 LOTS ,000 * 10 C per minute ramp rate * 10 minute dwell time -55 C -55 C BOARD THICKNESS BENCH 0624 LTM4600 LGA mils ,500 97,500 SnPb 0624 LTM4600 LGA mils , ,000 SnPb 2 LOTS ,500 * 10 C per minute ramp rate * 10 minute dwell time Page 3
4 DEMO BOARD MOUNT TEMP CYCLE DATA FOR THE LTM46XX FAMILY (15mmX9mm) BOARD THICKNESS ATE 0714 LTM4604 LGA mils , ,000 SnPb 0714 LTM4604 LGA mils , ,000 SnAgCu 0728 LTM4608 LGA mils , ,000 SnPb 0729 LTM4608 LGA mils , ,000 SnAgCu 4 LOTS ,000 * 10 C per minute ramp rate * 10 minute dwell time Page 4
5 Rider Card PCB Details PCB Material FR-4 or Polyimide # Metal Layers 4 Board Size 1 1/2" x 1 1/4" Thickness 93 mils Pad Type NSMD Pad Finish NiAu Pad Size 0.635mm Soldermask opening 0.686mm Soldermask thickness mm Method for Detecting Interconnect Failure ATE, Functional test Page 5
6 RIDER CARD MOUNT TEMP CYCLE DATA FOR THE LTM80XX FAMILY BOARD THICKNESS ATE 0723 LTM8023 LGA mils , ,000 SnPb 0723 LTM8023 LGA mils , ,000 SnAgCu 2 LOTS ,000 * 10 C per minute ramp rate * 10 minute dwell time Page 6
7 Daisy-Chain PCB Details Material FR-4 # Metal Layers 6 Board Size 6 1/4" x 6 1/4" Thickness 93 mils Pad Type SMD Pad Finish NiAu Pad Size 0.730mm x 0.730mm Soldermask opening 0.630mm x 0.630mm Soldermask thickness 0.035mm ± 0.010mm Daisy-Chain Test Details Tests Conform to Ramp Rate Dwell Time Method for Detecting Interconnect Failure IPC-9701A 10 C / minute 10 minutes Daisy Chain with Real-Time Resistivity Monitor Page 7
8 DAISY CHAIN TEMP CYCLE DATA 0 C +100 C 0 C +100 C CONTINUITY 0640 LTM4600 LGA , ,000 PbSn 0640 LTM4600 LGA , ,000 SnAgCu 0748 LTM4601A LGA , ,000 PbSn 0748 LTM4601A LGA , ,000 SnAgCu 0847 LTM2880 LGA , ,000 SnAgCu 0911 LTM9004 LGA , ,000 SnAgCu 0927 LTM4617 LGA , ,000 SnAgCu 1007 LTM2885 LGA , ,000 SnAgCu 1027 LTM4620 LGA , ,000 SnAgCu 9 LOTS ,845,000 LTM46xx μmodule Footprint Comparisons Page 8
9 LTM4600 Daisy Chain Failure Analysis 99% 4826 cycles. 1%, 1380 cycles Weibull plot for LTM4600 daisy chain Pb board mounted units after 0/100C 3500 cycles test. No failures found from PbF solder paste (up to 4000 T/C) Solder Fatigue and Edge Crack found at Corner Pin after 3500 cycles (Pb solder paste). Page 9
10 LTM4601A Daisy Chain Failure Analysis 1%, 1780 cycles Weibull plot above for LTM4601A Daisy Chain Pb board mounted units after 0/+100 C, 6000 cycles test. No failures found from PbF solder paste up to 3500 cycles. Cross-section above shows good solder joint integrity. Page 10
11 LTM2885 Daisy Chain Failure Analysis 1%, 3470 cycles PCB side LGA Package side Dye and pry after 6000 cycles shows A1 corner pin saturated. This DUT failed at 3773 cycles. Presence of dye indicates an solder joint failure at the A1 pin location. Page 11
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