Efficient Power Conversion Corporation

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1 The egan FET Journey Continues Using egan FETs for Envelope Tracking Buck Converters Johan Strydom Efficient Power Conversion Corporation EPC - The Leader in egan FETs PELS

2 Agenda Overview of Envelope Tracking Why egan FETs for Envelope Tracking Maximizing Device Performance Experimental Results Current Limitations Summary Q & A egan is a registered trademark of Efficient Power Conversion Corporation EPC - The Leader in egan FETs PELS

3 Overview of Envelope Tracking EPC - The Leader in egan FETs PELS

4 Why Envelope Tracking? Exabytes per Month Source: Cisco VNI Mobile Data Traffic Forecast % Compound annual growth rate (CAGR) Same average Reference: Nujira.com website EPC - The Leader in egan FETs PELS

5 Effect of PAPR Average Power Peak Power Fixed supply PAPR = 0dB Peak efficiency up to 65% Average efficiency only 25% Increasing PAPR Output Probability Output Power (dbm) EPC - The Leader in egan FETs PELS

6 Effect of Envelope Tracking Average efficiency ~50% (incl. ET) Only 1/3 the losses Envelope Tracking 60 ~100MHz BW ET for 4G LTE Output Probability Average Power Output Power (dbm) EPC - The Leader in egan FETs PELS

7 Hybrid ET Implementation Improvement in switching device performance buys: Improves overall ET efficiency Increases Switcher stage bandwidth Simplifies Linear stage design / Removes it entirely? Increase system BW which increases RFPA fidelity Kimball, Don, et al. "50% PAE WCDMA basestation amplifier implemented with GaN HFETs." Compound Semiconductor Integrated Circuit Symposium, CSIC'05. IEEE. IEEE, EPC - The Leader in egan FETs PELS

8 Why egan FETs for Envelope Tracking EPC - The Leader in egan FETs PELS

9 Idealized Switching V IN T CR T VF V DS I DS V V GS I ON V PL V TH α α t EPC - The Leader in egan FETs PELS

10 Hard-Switching Figure of Merit FOM HS =(Q GD +Q GS S2) R DS(on) (pc Ω) EPC Gen 4 EPC Gen 2 Vendor A Vendor B Vendor C Vendor D Vendor E 6.1x 3.5x 8.5x Drain-to-Source Voltage (V) V DS =0.5 V DSS, I DS =20 A EPC - The Leader in egan FETs PELS

11 High Frequency egan FETs EPC Part No. BV (V) Max. R DS(ON) Min. Typical Charge (pc) (mω) Peak Id (A) (V GS = 5V, (Pulsed, 25 o C, I D = 0.5 A) T pulse = 300 µs) Q G Q GD Q GS Q OSS Q RR Typical Capacitance (pf) (V DS = 20 V; V GS = 0 V) C ISS C OSS C RSS EPC EPC EPC EPC EPC EPC EPC EPC egan is a registered trademark of Efficient Power Conversion Corporation EPC - The Leader in egan FETs PELS

12 Hard Switching FOM EPC - The Leader in egan FETs PELS

13 dv/dt Turn-on Immunity Q GS1 >Q GD 20V 40V Q GS1 Q GD EPC8004 egan FET EPC - The Leader in egan FETs PELS

14 Maximizing Device Performance EPC - The Leader in egan FETs PELS

15 Common Source Inductance V IN T CR T VF V IN T CR T VF I ON I ON I DS V DS I DS V V DS GS V GS V PL V TH α α t EPC - The Leader in egan FETs PELS

16 Drain Packaging Evolution Gate Source Power Loss (W) egan FET SO-8 LFPAK DirectFET LGA Device Loss Breakdown 82% 18% Package Die 73% 27% 47% 53% V IN =12V V OUT =1.2V I OUT =20A F S =1MHz 18% 82% SO-8 LFPAK DirectFET LGA Efficiency (%) SO-8 LFPAK DirectFET LGA Switching Frequency (MHz) EPC - The Leader in egan FETs PELS

17 Converter Parasitics C in T SR L S : Common Source Inductance L Loop : High Frequency Power Loop Inductance Power Loss(W) Power Loss vs Parasitic Inductance Ls L Loop Parasitic Inductance (nh) V IN =12 V, V OUT =1.2 V, f sw =1 MHz, I OUT = 20 A EPC - The Leader in egan FETs PELS

18 EPC8XXX Package Drain 200 X2 Sub Gate Return Source S x All dimensions in µm EPC - The Leader in egan FETs PELS

19 Low Parasitic Layout Top Layer Vias to next layer To BUS caps Switch node Supply Return Source S Drain Sub PELS 2014 Gate Current orthogonal to drain current Vias to next layer Ground Source EPC - The Leader in egan FETs Sub Return Bottom Gate Gate Top Gate Gate Drain S 19

20 Low Parasitic Layout First Inner Layer Optimum power loop return To gate drive Drain Sub Optimum gate loop return Gate Return Source S To gate drive Drain Sub Optimum gate loop return Gate Return Source S EPC - The Leader in egan FETs PELS

21 EPC8000 Series Improvements Reduce active area for lower power / higher frequency operation Minimize Hard Switching Figure of Merit Complete dv/dt turn-on immunity Separate gate and power loops Minimize power loop inductance Minimize gate loop inductance EPC - The Leader in egan FETs PELS

22 Experimental Results EPC - The Leader in egan FETs PELS

23 ET Prototype Board 2X, SO-8 footprint Bus caps LM5113 EPC80XX EPC80XX EPC - The Leader in egan FETs PELS

24 20 V BUS, 10 MHz, 4 A Switching EPC - The Leader in egan FETs PELS ,

25 Efficien ncy 95% 93% 91% 89% 87% 85% 83% 81% 79% 77% 75% 73% 71% Near >4:1 step down ratio 15 V IN to 3.3 V OUT, 10 MHz Output Power (W) EPC8007 EPC - The Leader in egan FETs PELS Power Los ss (W)

26 42 V IN at 1 A OUT No measureable overshoot dv/dt interval 75V/ns slew rate di/dt interval Rise time ~1.0 ns Total switching time ~1.2 ns 2 ns/div and 10 V/div, 1 GHz 100:1 1pF TM probe EPC - The Leader in egan FETs PELS ,

27 42 V IN, 20 V OUT, 10 MHz Conduction Switching C OSS Additional losses EPC8005 EPC - The Leader in egan FETs PELS

28 Current Limitations EPC - The Leader in egan FETs PELS

29 Parasitic Losses Bootstra ap diode Reverse recovery charge V DD IC capacitance Level Shift V DD Switch-node rising edge half-bridge driver EPC - The Leader in egan FETs PELS

30 No-load Switching 10 MHz switching, no load, large dead-time 10 V/div, 100 ma/div, 10 ns/div Expected commutation based on egan FET C OSS Initially slow rising edge Actual voltage commutation slopes are different, even though currents are the same EPC - The Leader in egan FETs PELS

31 Loss Breakdown 10 MHz switching, no load, large dead-time 10 V/div, 100 ma/div, 10 ns/div Switch-node voltage Bootstrap Q RR Actual commutation based on total C OSS including IC capacitance EPC - The Leader in egan FETs PELS

32 42 V IN, 20 V OUT, 10 MHz Conduction Switching C OSS C OSS Gate Driver Switching Q RR Bootstrap diode EPC - The Leader in egan FETs PELS

33 egan FET Limited Efficiency Calculated efficiency improvement EPC - The Leader in egan FETs PELS

34 Summary New devices enable higher switching frequencies Switching 42 V, 40 W at 10 MHz at 89% possible. Driver parasitics limit performance light load losses can be cut in half, and full load losses can be reduced by 25% EPC - The Leader in egan FETs PELS

35 Thank you! Questions? EPC - The Leader in egan FETs PELS

36 The end of the road for silicon.. is the beginning of the egan FET journey! EPC - The Leader in egan FETs PELS

Driving egan FETs in High Performance Power Conversion Systems

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