Top View BAS70WQ BAS70W-04Q BAS70W-05Q BAS70W-06Q
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1 SUC MOU SCHOKY BI DIOD Product Summary V M (V) I O (m) V 1m (V) I V = 50V (μ) pplications SMPS DC-DC Converter reewheeling Diodes everse Polarity Protection Blocking Diodes eatures and Benefits Low urn-on Voltage ast Switching P Junction Guard ing for ransient and SD Protection Ultra-Small Surface Mount Package otally Lead-ree & ully ohs Compliant (otes 1 & 2) Halogen and ntimony ree. Green Device (ote 3) Qualified to C-Q101 Standards for High eliability PPP Capable (ote 4) Mechanical Data Case: SO323 Case Material: Molded Plastic, "Green" Molding Compound, UL lammability Classification ating 94V-0 Moisture Sensitivity: Level 1 per J-SD-020D erminals: Lead ree Plating (Matte in inish nnealed over lloy 42 Leadframe), Solderable per MIL-SD-202, Method 208 Polarity: See Diagrams Below Weight: grams (pproximate) op View BS70WQ BS70W-04Q BS70W-05Q BS70W-06Q Ordering Information (ote 5) Part umber Case Packaging BS70WQ-7- SO /ape & eel BS70W-04Q-7- SO /ape & eel BS70W-05Q-7- SO /ape & eel BS70W-06Q-7- SO /ape & eel otes: 1. o purposely added lead. ully U Directive 2002/95/C (ohs) & 2011/65/U (ohs 2) compliant. 2. See for more information about Diodes Incorporated s definitions of Halogen- and ntimony-free, "Green" and Lead-free. 3. Halogen- and ntimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <0ppm antimony compounds. 4. utomotive products are C-Q101 qualified and are PPP capable. efer to 5. or packaging details, go to our website at Marking Information Kxx YM Kxx = Product ype Marking Code K73 = BS70WQ K74 = BS70W-04Q K75 = BS70W-05Q K76 = BS70W-06Q YM = Date Code Marking Y = Year (ex: D = 2016) M = Month (ex: 9 = September) Date Code Key Year Code X Y Z B C D G H I J K Month Jan eb Mar pr May Jun Jul ug Sep Oct ov Dec Code O D 1 of 5
2 Maximum atings = +25 C, unless otherwise specified.) Characteristic Symbol Value Unit Peak epetitive everse Voltage Working Peak everse Voltage V M V WM 70 V DC Blocking Voltage V MS everse Voltage V (MS) 49 V orward Continuous Current (ote 6) I O 70 m on-epetitive Peak orward Surge t p < 1.0s I SM m hermal Characteristics Characteristic Symbol Value Unit Power Dissipation (ote 6) P D 200 mw hermal esistance Junction to mbient ir (ote 6) θj 625 C/W Operating emperature ange J -55 to +125 C Storage emperature ange SG -65 to +150 C lectrical Characteristics (@ = +25 C, unless otherwise specified.) Characteristic Symbol Min Max Unit est Condition everse Breakdown Voltage (ote 7) V (B) 70 I = 10µ orward Voltage V mv t p < 300µs, I = 1.0m t p < 300µs, I = 15m everse Current (ote 7) I n t p < 300µs, V = 50V otal Capacitance C 2.0 p V = 0V, f = 1.0MHz everse ecovery ime t 5.0 ns I = I = 10m to I = 1.0m, I = 0.1 x I, L = Ω otes: 6. Device mounted on -4 PCB, 1 inch x 0.85 inch x inch; pad layout as shown in Diodes Incorporated s package outline PDs, which can be found on our website at 7. Short duration pulse test used to minimize self-heating effect. ) m ( U C D W O S U O S I, I I, ISOUS OWD CU (m) = 75ºC = 25ºC = 125ºC = 0ºC = -40ºC V, ISOUS OWD VOLG (V) ig. 1 ypical orward Characteristics I, ISOUS VS CU (n) 10,000 1, V, ISOUS VS VOLG (V) ig. 2 ypical everse Characteristics 2 of 5
3 ote 6 C, OL CPCIC (p) V, DC VS VOLG (V) ig. 3 otal Capacitance vs. everse Voltage P D, POW DISSIPIO (mw) , MBI MPU ( C) ig. 4 Power Derating Curve, otal Package 3 of 5
4 Package Outline Dimensions Please see for the latest version. SO323 D 2 1 b e c 1 L a SO323 Dim Min Max yp b c D e BSC e L a ll Dimensions in mm e1 Suggested Pad Layout Please see for the latest version. SO323 X Y1 G Y Value Dimensions (in mm) C G X Y Y C 4 of 5
5 IMPO OIC DIODS ICOPOD MKS O WY O Y KID, XPSS O IMPLID, WIH GDS O HIS DOCUM, ICLUDIG, BU O LIMID O, H IMPLID WIS O MCHBILIY D ISS O PICUL PUPOS (D HI QUIVLS UD H LWS O Y JUISDICIO). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. ny Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. his document is written in nglish but may be translated into multiple languages for reference. Only the nglish version of this document is the final and determinative format released by Diodes Incorporated. LI SUPPO Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief xecutive Officer of Diodes Incorporated. s used herein:. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. urther, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright 2016, Diodes Incorporated 5 of 5
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