AT&S First choice for advanced applications Investor and Analyst Presentation April 2018

Transcription

1 AT&S First choice for advanced applications Investor and Analyst Presentation April 2018 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Fabriksgasse 13 A-8700 Leoben Tel +43 (0)

2 Table of Contents Company Overview Strategy & Market Financials Annex Investor and Analyst Presentation 1

3 AT&S a world leading high-tech PCB & IC substrates company High-end interconnect solutions for Mobile Devices, Automotive, Industrial, Medical Applications and Semiconductor Industry # 1 manufacturer in Europe Continuously outperforming market growth 814.9m revenue in FY 2016/17 10,039 employees # 3 in high-end technology worldwide Cost-competitive production footprint with 6 plants in Europe and Asia Investor and Analyst Presentation 2

4 What guides us VISION FIRST CHOICE FOR ADVANCED APPLICATIONS MISSION We set the highest quality standards in our industry We industrialize leading-edge technology We care about people We reduce our ecological footprint We create value Investor and Analyst Presentation 3

5 4 Market Segments & Product Applications served by AT&S Computer, Communication, Consumer IC substrates Automotive Industrial Medical Smartphones, Tablets, Wearables, Ultrabooks, Cameras High Performance Computer, Microserver Advanced Driver Assistance Systems, Emergency-Call, X2X Communication Machine-2-Machine Communication, Robots, Industrial Computer, X2X Communication Patient Monitoring, Hearing Aids, Pacemaker, Neurostimulation, Drug Delivery, Prosthesis Segment Mobile Devices & Substrates Segment Automotive, Industrial, Medical Investor and Analyst Presentation 4

6 Our competitive advantages Strategic focus on high-end technologies and applications Scale innovation and technology leverage between customer segments Outstanding process know-how and process efficiency Highest quality First high-end IC substrates manufacturer in China Investor and Analyst Presentation 5

7 AT&S Key Facts 1 Good track record 2 Balanced portfolio/global customer base Split revenue: Business Unit, Q /18 in millions % 67% Mobile Devices & Substrates Automotive, Industrial, Medical +9% +13% +14% +7% +24.5% * 131* 102* 190 7* 12* / / / / /17 Q /17 Revenue EBITDA EBIT * Based on ramp-up effects for new plants in China Q /18 Revenue growth Split revenue: Customer Region, Q /18 based on sold to party 10% 6% Americas 21% 63% 7% Germany/Austria Asia Other European countries Investor and Analyst Presentation 6

8 Global footprint ensures proximity to supply chain & cost efficiency AT&S plant & sales office AT&S sales office AT&S Headquarters 1,012* 394* 1,136* 2,388* 4,725* 309* Plant Leoben, Headquarters Austria Plant Fehring Austria *Staff, Average, FTE, Q /18; 73 employees in other locations Plant Nanjangud India Plant Chongqing China Plant Shanghai China Plant Ansan Korea Investor and Analyst Presentation 7

9 Table of Contents Company Overview Strategy & Market Financials Annex Investor and Analyst Presentation 8

10 From vision to strategy Vision: First choice for advanced application Targets/Key Performance Indicators Expansion of technology leadership Leading provider of new interconnect solutions Innovation revenue rate: > 20% Long-term profitable growth Medium-term EBITDA margin target of > 20% Short-term revenue target of 1 billion Creation of shareholder value Long-term ROCE of 12% Strategy Focus on high-end technologies and applications Focus on innovative solutions Focus on fast-growing and profitable applications Highest service level and customer orientation Operational excellence Focus on cash flow generation Sustainable business development with focus on ROCE Transparent dividend payout The best employees and management team members Talent programs Training and continuing development Leadership Excellence program Sustainable business leadership Benchmark in the industry through reduction of: 5% in CO 2 emissions p.a. 3% in freshwater consumption p.a. Capital Excellence Equity ratio: > 40% Financing costs of < 2% (in a corresponding interest environment) Payback period of debt of < 3 years Investor and Analyst Presentation 9

11 Strategic focus on high-end technologies AT&S Revenue structure in H1 2017/18 based on technologies High-end technology share > 75% HDI and any-layer PCBs, Embedding High-end HDI PCBs and IC substrates ~ 30% Single-sided (SS), double-sided (DS), multilayer- (ML), flex and rigid-flex (RF) PCBs ~ 70% Complementary technology share: < 25% SS, DS, ML, Flex, RF Structure of general PCB market based on technologies Source: Prismark PCB Report 2Q17/ August 2017; AT&S Controlling Investor and Analyst Presentation 10

12 PCB market Overview Forecast for the total PCB market until 2021: CAAGR of 2.5% % % % 3.5% % AT&S outperformed a flat market in the past 6 years and is set to continue to do so also in the future Index (2011 = 100)* * PCB & substrates market AT&S revenue USD in billions (0.2%) AT&S outperformed the market by scaling high-end any-layer technology and by leveraging HDI technology to the Computer-, Consumer-, Automotive-, Industrial and Medical market Computing Consumer Industrial/Medical Communication Automotive Military/Aerospace Source: Prismark, February 2017, Yole April 2017 * Basis 2011: PCB & substrates market: USD 55.4bn AT&S revenue: 514m Investor and Analyst Presentation 11 11

13 12 Market Player/Position HDI Technology Market position HDI Technology Revenue (USD in millions) Rank Country Supplier HDI Non HDI PCBs IC substrates Total revenue 1 TWN Unimicron ,122 2 TWN Compeq ,395 3 AUT AT&S * USA TTM 501 1,987-2,488 5 JPN Ibiden ,297 6 TWN Tripod 316 1,052-1,368 7 TWN Unitech KOR SEMCO ,344 9 JPN Meiko KOR DAP Source: Prismark 2016; NTI 2016; AT&S Strategy * N/A due to single customer Investor and Analyst Presentation 12

14 Driving the future: Internet of Things (IoT) Applications Wearable Electronics Healthcare & Fitness Smart Watches and Glasses Smart Mobility Smart City Smart Buildings Smart Production/Industry 4.0 Smart Healthcare Smart Energy Autonomous Driving Car2X Communication Smart Lighting Home/Building Automatization Smart Home Devices Automatization/Robotics Machine-to-Machine Communication Connected Patient Monitoring Systems Connected Consumer Healthcare Devices Smart Metering Building Blocks of IoT Modules: Sensing, Connectivity, Energy Storage/Harvesting, Power Management billion of Things will be connected in 2020 Wearable electronic devices offer revenue opportunities of USD 61.7bn beyond the smartphone market in 2020 Source: Gartner Inc Investor and Analyst Presentation 13

15 Driving the industry: miniaturization & modularization 2003/ X? TYPE Mobile Phone Smartphone Smartphone All in One PCB 125x55mm 85x20mm 80x20mm 25x25mm? FORM FACTOR ? LINE/SPACE 100/100µm 40/40µm 30/30µm 10/10µm TECHNOLOGY 1-n-1 Any-layer msap Any-layer FO/SAP/mSAP Investor and Analyst Presentation 14

16 R&D as the key for technological leadership 7.7% R&D Quota (in % in relation to revenue) 227 Patents International R&D Partners R&D Headquarters Austria Industrialization at the respective production site 21.8% Innovation Revenue Rate * As of FY 2016/17 (ended 31/03/2017) * Revenue generated with products with new, innovative technologies introduced to the market within the last three years Investor and Analyst Presentation 15

17 Future positioning as leading high-end interconnect solutions provider More than AT&S Overview of the transformation from a high-end PCB manufacturer to a high-end interconnect solutions provider: Extended technology toolbox Additional customers Core business + New technologies and interconnect solutions Additional applications Broader positioning in the value chain Investor and Analyst Presentation 16

18 Table of Contents Company Overview Strategy & Market Financials Annex Investor and Analyst Presentation 17

19 Strong top-line growth and profitability, improved Cash Flow Revenue YoY growth EBITDA and EBITDA margin Operating Cash Flow YoY development % 21.6% 25.1% 22.0% 16.1% 16.6% 24.8% in millions in millions; % in millions High demand, additional revenue contribution from both plants in Chongqing. Negative FX impact of 23.9m. General high operational performance, successful implementation & optimization of msap technology. Solid operating cash flow reflects strong earnings in first nine months. Investor and Analyst Presentation 18

20 Business Development Mobile Devices & Substrates in millions (unless otherwise indicated) Q /17 Q /18 Change in % Revenue % Revenue with external customers % EBITDA % EBITDA margin 12.8% 26.8% - Revenue increase mainly on the back of the two plants in Chongqing EBITDA improvements as a result of general efficiency measures and higher contribution margin Price pressure on IC substrates remains Revenue per quarter* Trendline expressing seasonality Q2 2014/15 Q3 2014/15 Q4 2014/15 Q1 2015/16 in millions; * Revenue with external customers Investor and Analyst Presentation Q2 2015/16 Q3 2015/16 Q4 2015/16 Q1 2016/17 Q2 2016/17 Q3 2016/17 Q4 2016/17 Q1 2017/18 Q2 2017/18 Q3 2017/18 19

21 Business Development Automotive, Industrial, Medical in millions (unless otherwise indicated) Q /17 Q /18 Change in % Revenue % Revenue with external customers % EBITDA (12.6%) EBITDA margin 14.1% 11.9% - Continued growth path in all sub-segments, particularly in Industrial and Medical EBITDA below last year s level which included a reversal of provision of 3.3m for previously unused space EBITDA margin impacted by negative FX effects, higher raw material prices Revenue per quarter* Q2 2014/15 Q3 2014/15 Q4 2014/15 Q1 2015/16 in millions; * Revenue with external customers Investor and Analyst Presentation Q2 2015/16 Q3 2015/16 Q4 2015/16 Q1 2016/17 Q2 2016/17 Q3 2016/17 Q4 2016/17 Q1 2017/18 Q2 2017/18 Q3 2017/18 20

22 Net CAPEX & Staff Net CAPEX Q1-Q3: 124.6m for maintenance incl. technology upgrades and Chongqing phase 1 STAFF* The increased headcount is primarily based on Chongqing ,759 9,526 10, ,321 7,027 7, / / / / /17 Q / / / / / /17 Q /18 in millions * incl. contractors, FTE, average for the period Investor and Analyst Presentation 21

23 Financials Q /18 in thousands (unless otherwise stated) STATEMENT OF PROFIT OR LOSS Q /17 Q /18 Change YoY Revenue 615, , % produced in Asia 82% 85% 3pp produced in Europe 18% 15% (3pp) EBITDA 102, , % EBITDA margin 16.6% 24.8% 8.2pp High demand, additional revenue contribution from both plants in Chongqing. Negative FX impact of 23.9m. General high operational performance, successful implementation & optimization of msap technology. EBIT 11,840 88,801 >100% EBIT margin 1.9% 11.6% 9.7pp Finance costs net (18,551) (11,283) 39.2% Income taxes (13,038) (29,742) (>100%) Positive FX effects of 2.0m (Q1-Q3 2016/17: FX expense 8.2m. Reduced tax scheme in Shanghai still pending. Profit for the period (19,749) 47,776 >100% Earnings per share ( 0.51) 1.21 >100% Investor and Analyst Presentation 22

24 Financials Q /18 in thousands (unless otherwise stated) 31 Mar Dec 2017 Change STATEMENT OF FINANCIAL POSITION Non-current assets 1,029, ,813 (7.3%) Current assets 407, , % Equity 540, , % Non-current liabilities 569, ,116 (2.4%) Negative FX effects (mainly RMB-EUR and USD-EUR) of 57.9m. Positive: Hybrid bond issue ( 173.0m) Current liabilities 326, ,149 (14.9%) Total assets 1,436,694 1,533, % Net debt 380, ,028 (43.0%) Hybrid bond issue Net gearing 70.5% 31.0% (39.5pp) Net working capital 24,374 73,412 >100% Ususal seasonal increase in BU MS Net working capital per revenue 3.0% 7.2% 4.2pp Equity ratio 37.6% 45.6% 8.0pp Increase as a result of hybrid bond issue and net profit Investor and Analyst Presentation 23

25 Key credit figures Gross debt, financial assets and cash, net debt Net debt/ebitda / / / / /17 Q /18 Gross debt Financial assets and cash Net debt in millions 2012/ / / / /17 Multiple Net debt decrease based on lower net capex (Chongqing phase I finished) & Hybrid bond issue Target: < 3x Investor and Analyst Presentation 24

26 Overview Debt Portfolio Duration Maturity in millions* < 1 Year 1-5 Years > 5 Years Total Promissory note loans Promissory note loans Currency mix of debt portfolio 16.3% Promissory note loans Subsidized loans Bank Borrowings and others Total 31/12/ Total 31/03/ % * Including accrued interest and placement costs Average debt portfolio duration: 3.3 years (2016/17: 3.7 years) 191m of credit lines not utilized (31/03/2017: 201m) EUR USD Average financing costs: 2.5% (31/03/2017: 2.6%) Currency mix of EUR and USD to support natural hedging strategy Investor and Analyst Presentation 25

27 Financials Q /18 in thousands STATEMENT OF CASH FLOWS Q /17 Q /18 Change YoY Operating result (EBIT) 11,840 88,801 >100% Paid/received interests (11,628) (10,446) 10.2% Paid taxes (10,706) (14,697) (37.3%) Non cash bearing of profit or loss 85, , % Cash flow from operating activities before changes in working capital 74, ,305 >100% Changes in working capital (57,705) (49,293) 14.6% Cash flow from operating activities 16, ,012 >100% Main drivers: increase of inventory by 30.5m and increase of receivables by 34.2m Cash flow from investing activities (108,650) (246,612) (>100%) Cash flow from financing activities 78, , % Hybrid bond issue Change in cash and cash equivalents (13,406) 9,819 >100% Operating free cash flow 1) (175,473) (3,631) 97.9% Free cash flow 2) (91,846) (125,600) (36.8%) 1) Cash flow from operating activities minus Net CAPEX 2) Cash flow from operating activities minus cash flow from investing activities Investor and Analyst Presentation 26

28 Net Working Capital Management 19.0% Net Working Capital development 15.6% 14.3% % % % / / / / /17 Q /18 in millions; % of revenue Net working capital Net working capital per revenue Investor and Analyst Presentation 27

29 AT&S Stock Profile Listing: Indices: Thomson Reuters (A): Bloomberg (A): Financial Calendar Vienna Stock Exchange, Prime Standard ATX Prime, WBI ATSV.VI ATS:AV # of shares outstanding 38.85m Average daily volume*: ~ 111,789 shares Performance 1 year*: +114% Dividend 2016/17: 0.10 per share Dividend yield: 1.0% * 03/04/ /03/2018 Shareholder structure Annual results 2017/18 08 May 2018 Record date Annual General Meeting 25 June th Annual General Meeting 05 July 2018 Ex-dividend day 24 July 2018 Record date dividend 25 July 2018 Dividend payment day 26 July 2018 Investor and Analyst Presentation 28

30 Outlook FY 2017/18 For Q4: > usual seasonality > continuous price pressure particularly for IC substrates FY 2017/18 provided a stable market environment and exchange rate development: > revenue growth of 20-25% > EBITDA margin: based on strong Q1-Q3 earnings - slightly above given forecast of 19-22% > additional depreciation of ~15m Investor and Analyst Presentation 29

31 Table of Contents Company Overview Strategy & Market Financials Annex Investor and Analyst Presentation 30

32 AT&S Product Portfolio I ECP : Embedded Component Packaging IC substrates Substrate-like printed circuit boards msap Embedded Component Packaging allows to embed active/passive components (e.g. wafer level dies) within the layers of a PCB contributes to miniaturization. IC substrates serve as interconnection platform with higher density (Line/Space < 15 micron) between semiconductors (Chips) & PCBs. Substrate-like PCBs (msap technology) are the next evolution of high-end HDI PCBs with higher density: Line/Space < 30 micron. Production site Leoben, Shanghai Chongqing Chongqing, Shanghai Applications Devices such as smartphones, tablets, digital cameras and hearing aids High-end processors for Computer, Communication, Automotive, Industrial Mobile applications like smartphones Investor and Analyst Presentation 31

33 AT&S Product Portfolio II HDI any-layer printed circuit boards HDI microvia printed circuit boards high density interconnect Multilayer printed circuit boards Double-sided printed circuit boards IMS printed circuit boards insulated metal substrate Further technological enhancement to HDI microvia: All electrical connections in HDI any-layer boards consist of laserdrilled microvias. Advantage: further miniaturization, and higher performance and reliability. AT&S produces HDI any-layer in 4 to 12 layers. HDI: high density interconnect, meaning laser-drilled connections (microvias). HDI is first step towards miniaturization. AT&S can produce 4-layer laser PCBs up to 6-n-6 HDI multi layer PCBs. Found in almost every area of industrial electronics. AT&S produces printed circuit boards with 4 to 28 layers, in quantities from individual prototypes to small batches and mass production. Used in all areas of electronics. AT&S focuses on double-sided printed circuit boards with thicknesses in the range of mm. IMS: insulated metal substrate. Primary function: heat dissipation for use mainly with LEDs and power components. Production site Shanghai Shanghai, Leoben Leoben, Nanjangud, Fehring Fehring, Nanjangud Fehring Applications Smartphones, Tablets, Notebooks Mobile phones and nearly all electronic applications including automotive (navigation, infotainment and driver assistance systems) Used in all electronic applications including touch panels, and in products ranging from aircraft to motorcycles, from storage power plants to solar arrays Primarily industrial and automotive applications Lighting industry Investor and Analyst Presentation 32

34 AT&S Product Portfolio III Flexible printed circuit boards Used to replace wiring and connectors, allowing for connections and geometries that are not possible with rigid printed circuit boards. Semi-flexible printed circuit boards More limited bend radius than flexible printed circuit boards. The use of a standard thin laminate makes them a cost-effective alternative. Rigid-flex printed circuit boards Combine the advantages of flexible and rigid printed circuit boards, yielding benefits for signal transmission, size and stability. Production site Ansan, Fehring Fehring Leoben, Ansan Ansan Applications Nearly all areas of electronics, including measuring devices and medical applications Automotive applications Industrial electronics, such as production machines and industrial robots Flexible printed circuit boards on aluminum Used when installing LEDs in car headlights, for example, where the printed circuit board is bonded to an aluminum heat sink to which the LEDs are then attached. Lighting, automotive, building lighting AT&S patented technologies ECP : Embedded Component Packaging ECP is a patented AT&S packaging technology used to embed active and passive electronic components in the inner layers of a printed circuit board. ECP technology is used in ever smaller, more efficient and more powerful devices, such as smartphones, tablets, digital cameras and hearing aids. Production sites: Leoben, Shanghai 2.5D Technology Platform Combines mechanical and electronic miniaturization, and enables partial reduction of the thickness of a circuit board. Advantage: populated assemblies have a thinner profile. Can be also used to make cavities in the printed circuit board, e.g. for acoustic channels. Major application for this technology is the 2.5D rigidflex printed circuit board, a lower cost alternative for flex-to install applications. Production sites: Leoben, Shanghai Investor and Analyst Presentation 33

35 Management Andreas Gerstenmayer, CEO Monika Stoisser- Göhring, CFO Heinz Moitzi, COO Joined AT&S as CEO in 2010 Previous positions include: 18 years of work experience at Siemens, including Managing Director with Siemens Transportation Systems GmbH Austria and CEO of the Drive Technology business unit in Graz from 2003 to 2008 Partner at FOCUSON Business Consulting GmbH after leaving Siemens Education: Degree in Production Engineering from Rosenheim University of Applied Sciences CFO since 2017 Previous positions include: Since 2011 with AT&S in senior positions in Finance and Human Resources Various positions at international accounting and tax consulting companies Education: Training as Tax Consultant Degree in Business Administration from Karl-Franzens University Graz COO since 2005; with AT&S since ) Previous positions include: Various management positions within AT&S Measurement engineer with Leoben University of Mining and Metallurgy Education: Degree from Higher Technical College of Electrical Engineering 1) He was already with the founding company of AT&S Investor and Analyst Presentation 34

36 Milestones in the Group s history 1987 Founding of the Group, emerging from several companies owned by the Austrian State Owned Industries 1994 Privatization and acquisition by Messrs Androsch, Dörflinger, Zoidl 1999 Initial public offering on Frankfurt Stock Exchange ( Neuer Markt ). Acquisition of Indal Electronics Ltd., largest Indian printed circuit board plant (Nanjangud) today, AT&S India Private Limited 2002 Start of production at new Shanghai facility one of the leading HDI production sites in the world 2010 Start of production at plant II in India 2009 New production direction: Austrian plants produce for high-value niches in the automotive and industrial segment; Shanghai focuses on the high-end mobile devices segment 2011 Construction starts on new plant in Chongqing, China Capacity increase in Shanghai by 30% 2008 AT&S change to Vienna Stock Exchange 2006 Acquisition of Korean flexible printed circuit board manufacturer, 2013 AT&S enters the IC substrate market in cooperation with a leading manufacturer of semiconductors AT&S again achieves record high sales and earnings for financial year 2014/15 and decides to increase the investment program in Chongqing from 350 million to 480 million Tofic Co. Ltd. today, AT&S Korea Co., Ltd. AT&S starts serial production of IC substrates at the plant in Chongqing Investor and Analyst Presentation 35

37 36 A sustainability benchmark in the industry Highest resource efficiency Highest standards at all locations worldwide Highest transparency Revenue growth Environment: ISO Resource consumption stable/declining Safety: OHSAS Energy: ISO Quality: ISO 9001, ISO/TS AS/EN 9100, DS/EN Sustainability reporting since 2012/13 Gold recognition from the Responsible Business Alliance Conflict minerals reporting Public CDP reporting on climate change (C score) and water (B score) * Basis for CO 2 output: 2015/16 Investor and Analyst Presentation 36

38 AT&S First choice for advanced applications IR contact Gerda Königstorfer Tel: Mobile: Fax: Johannes Mattner Tel: Mobile: Visit: IR_PR; AtundS Fabriksgasse 13, 8700 Leoben/Austria Investor and Analyst Presentation 37

39 Disclaimer This presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria ( AT&S ), and the contents are proprietary to AT&S and for information only. AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein, and no reliance may be placed for any purpose whatsoever on the information contained in this presentation, which has not been independently verified. You are expressly cautioned not to place undue reliance on this information. This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management s expectations and assumptions. However, such statements are by their very nature subject to known and unknown risks and uncertainties. As a result, actual developments, results, performance orevents may vary significantly from the statements contained explicitly or implicitly herein. Neither AT&S, nor any affiliated company, or any of their directors, officers, employees, advisors or agents accept any responsibility or liability (for negligence or otherwise) for any loss whatsoever out of the use of or otherwise in connection with this presentation. AT&S undertakes no obligation to update or revise any forward-looking statements, whether as a result of changed assumptions orexpectations, new information or future events. This presentation does not constitute a recommendation, an offer or invitation, or solicitation of an offer, to subscribe for or purchase any securities, and neither this presentation nor anything contained herein shall form the basis of any contract or commitment whatsoever. This presentation does not constitute any financial analysis or financial research and may not be construed to be or form part of a prospectus. This presentation is not directed at, or intended for distribution to or use by, any person or entity that is a citizen or resident or located in any locality, state, country or other jurisdiction where such distribution, publication, availability or use would be contrary to law or regulation or which would require any registration or licensing within such jurisdiction. Investor and Analyst Presentation 38