Investor Presentation March Quarter 2013

Transcription

1 Investor Presentation ch Quarter 2013

2 Safe Harbor Statement In addition to historical statements, this presentation and oral statements made in connection with it may contain statements relating to future events and our future results. These statements are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, and include, but are not limited to, statements that relate to our future revenue and statements under the sub-headings Vision and Mission on slide 6 of this presentation. While these forward-looking statements represent our judgments and current expectations concerning our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from our expectations. These factors include, but are not limited to: the risk that customer orders already received may be postponed or canceled, generally without charges; the risk that anticipated customer orders may not materialize; the risk that our suppliers may not be able to meet our demands on a timely basis; 3 rd party market forecasts don t materialize and the risk that replacement and incremental demand drivers do not increase demand for our products; the risks of a slowdown of transition from gold to copper Wire Bonding by our customers and the industry, the volatility in the demand for semiconductors and our products and services; volatile global economic conditions, which could result in, among other things, sharply lower demand for products containing semiconductors and for the Company s products, and disruption of capital and credit markets; the risk of failure to successfully manage our operations; acts of terrorism and violence; risks, such as changes in trade regulations, currency fluctuations, political instability and war, which may be associated with a substantial non-u.s. customer and supplier base and substantial non-u.s. manufacturing operations; and the factors listed or discussed in Kulicke and Soffa Industries, Inc Annual Report on Form 10-K and our other filings with the Securities and Exchange Commission. Kulicke & Soffa Industries, Inc is under no obligation to (and expressly disclaims any obligation to) update or alter its forward-looking statements whether as a result of new information, future events or otherwise. 2

3 Agenda Company Overview Geographic Footprint Product Portfolio Core ket Overview End-Applications Served Incremental & Replacement Demand Drivers ket Outlook Ongoing Shareholder Value Creation Competitive Growth Advantages Strategic Business Development Financial Performance & Summary ch Quarter Financial Results 3

4 Company Overview

5 About Kulicke & Soffa (K&S) Kulicke & Soffa is the Global Technology & ket Leader in Semiconductor Packaging & Assembly Equipment Rich history of technology leadership & innovation Founded in 1951 publicly traded since 1961 Listed on NASDAQ: KLIC Leadership positions in markets served Strong global presence with 88% of sales in Asia 2,328 Employees as of April 30, 2013 K&S continues to serve critical role in major industry innovations & transitions 5

6 Vision, Mission & Core Values Vision To be the leading technology provider of comprehensive interconnect solutions for the microelectronics industry Mission Grow our leadership position in Wire Bonding and Expendable Tools, and lead the industry in transitioning to copper Wire Bonding Broaden our product portfolio by leveraging our core competencies to accelerate our revenue growth Consistently deliver superior financial performance to maximize shareholder values Be at the forefront of technology by leveraging strategic partnerships with customers, suppliers and research institutes Foster a positive work environment by weaving our core values into the fabric of our organization ONE K&S Core Values Delight Our Customers People Matter Learn, Grow, Excel Innovate for Success Make a Difference 6

7 Global Presence 7

8 ket Driven Products ConnX Plus IConn ConnX ConnX-LED ConnX-VLED IConn ProCu Ball Bonder Wedge Bonder PowerFusion 3700 Plus 3600 Plus Software Microelectronics Equipment ATPremier Plus ibond Service Capillaries Dicing Blades 8

9 Leadership Positions K&S ket Leading Solutions ket Technical Advantages ket Share Ranking Ball Bond Wedge Bond Stud Bump Best in class accuracy, up to +/- 2.0µm Ultra fine pitch (35µm) Wire Bonding capability Highest production (units per hour) Single & multi-head machine configurations Unique, wafer level packaging Expanding application opportunities #1 #1 #1 Capillaries Highly customized application specific #1 9

10 Core ket Overview

11 End-Applications Served IC End-Applications Smartphones, Tablets, Laptops, Flash Memory, Computers, Cameras, Television Sets kets Served Consumer Devices Communications Data Processing Automotive Industrial Aerospace Pacemakers, Hearing Aids Safety Equipment, Sensors, Vehicle Electronics, Engine Control Systems, Security Systems Servers, Controllers, Routers LED End-Applications Back Lighting & General Lighting 11 Indicator & High Bright Surface & Vertical Mount

12 Semiconductor Unit Growth 2012 Global Semiconductor Demand by Application (Billions of Units) Data Processing 162 Consumer 170 Industrial 88 Aerospace 12 Automotive 33 Communications CAGR Projections Unit Revenue Automotive 17% 8% Communications 7% 6% Consumer 12% 1% Data Processing 8% 7% Industrial 19% 9% Aerospace 2% 3% Total ket 11% 6% Semiconductor Units Expected to Grow Faster than Revenue Consumer demand accounted for 25% of the overall Semiconductor market in 2012 The 5% gap between Unit & Revenue CAGR s suggests cost will remain a significant value driver for the Semiconductor industry Source(s): Gartner, Dec

13 Lead/Pin Count Growth Drives Incremental Equipment Demand Semiconductor Lead-Count Continues to Accelerate (Trillions of Leads) >500 Lead Lead Lead <128 Lead CAGR % 13% 12% 7% Calendar Year 2012 Forecast Each I/O (Lead/Pin) requires an interconnect ket research forecasts 82% of Integrated Circuit (IC) packages will be Wire Bonded and 18% Advanced Interconnect by 2016 LED lead-count demand is incremental to semiconductor lead-count & should be considered separately Source(s): VLSI Research, ch 2013; Prismark August

14 Technology Shifts Drive Replacement ket Copper Bonder Unit Growth Advances in Wire Bonding Ball Bonders in Production (Thousands) Cu BB (K Units) Au BB (K Units) % Copper Capable % 50% 40% 30% 20% 10% 0% % Copper Capable Copper Wire Bonding Package on Package Stacked-Die Ultra Low Loop Low-K Bonding Node Shrink Fiscal Year Roughly 30% of bonders currently in production are copper capable K&S expects 70%+ of total Wire Bonder s in production to convert to copper Wire Bonding has & is expected to continue enabling new technology trends Source(s): K&S Estimates, Apr

15 Leading the Wire Bonder Equipment ket K&S has established a dominant market share through technology & strategic R&D investment over the past 5 years Wire Bonder Equipment market is forecasted to represent an average size of $900M over the next 4 years LED Bonder ket is incremental & is not represented in forecast ket Forecast Source(s): VLSI Research, April

16 Ongoing Shareholder Value Creation

17 Optimized Operating Model Fine-Tuned Operating Model Drives Significant Cost Advantages & Leverage Capabilities Multi-sourced mitigates risk & reduces costs Supplier deliveries tied directly to factories daily build rate Supply Chain Leverage Flexible Manufacturing Model 4x workforce flexibility Global operations are based on Lean Production principles Efficient internal & external distribution channels Global team of 300+ Sales, Service & Support staff localized in key markets Extensive Sales, Service & Support Network 17

18 Innovation Through Engineering Excellence Creating an Unfair Advantage Knowledge Driven Product Development Structure ket Leading Innovation 450+ Engineers K&S hires the best talent from leading International Universities 80% of Engineering group focused on new product development Motion Systems Competency roadmaps are grouped in lanes that represent Golden Arrows This Golden Arrow approach fosters collaboration & knowledge sharing across product lines Vision Systems Ultrasonics Materials Handling Innovations are rapidly commercialized by pulling from Golden Arrow competency lanes Competency lanes can be leveraged into New Growth Opportunities Process Development 18

19 Transformative Business Development Group Installed Base of K&S Copper Wire Bonders LED 21% Unit CAGR MEMS 10% ket CAGR Cu Bonders Kits Advanced Packaging $400M 2016 ket Opportunity Business development group consists of senior cross-functional leaders Long-term strategic action plan improves growth initiatives, evaluation, prioritization & execution K&S is currently developing a next generation Thermo-Compression Bonder to serve the emerging Advanced Packaging ket Source(s): Gartner, Aug 2012; Yole Development, Aug 2012, Internal Estimates, Apr

20 Financial Performance & Summary

21 Continued Through-Cycle Financial Performance Revenue ($M) Operating gin % 22.6% 21.9% 14.8% 21.1% 27.7% 12.6% 13.8% 10.3% 29.9% 26.1% 7.7% 3.7% Jun Sep Dec Jun Sep Dec Jun Sep Dec '13 Jun Sep Dec Jun Sep Dec Jun Sep Dec ' R&D ($M) * $106.1M of Revenue & $7.3M of Net Income earned over prior quarter Product differentiation through continuous R&D commitment Company-wide cost containment program improves variable cost base 21 Jun Sep Dec Jun Sep Dec *Due to ongoing cost-containment & favorable $3.0M Dec RISC grant adjustment Jun Sep Dec '13

22 Strong Balance Sheet & Cash Position $136.4M Working Capital* as of Q2 FY 13 Total Cash & Debt Balance ($M) $600 Days Sales Outstanding Days Sales of Inventory Accounts Payable Days Cash Conversion Q2 FY days 72 days 41 days 130 days Total Cash & Short Term Investments Total Debt $500 $400 $300 $200 $100 Debt free as of June 2012 $6.51 cash per share & $8.64 of book value per diluted share as of ch 30, 2013 ROIC centric organization driven towards ongoing operational efficiency Q1 Fiscal Year 2013 Q $0 *Defined as: Accounts Receivable plus Inventory less Accounts Payable 22

23 Structured for Growth Optimized Operating Model Innovative Technology Development Core Financial Strength Flexible & Lean model 300 Localized Sales, Service & Support Staff Scale through highvolume business Highly talented Engineering group Structured and proven development process $499M of cash No-Debt Strategic Business Development Core-ket Leadership Dominating Copper Growing LED ket Share Expanding Wafer Level Stud Bump into New kets Maintaining Wedge Bonder ket Leadership Incremental Growth Opportunities Entering the Emerging Advanced Packaging ket Examining Organic & Inorganic Growth Opportunities 23