Ultrafast epitaxial rectifier diode in a SOT226 (I2PAK) plastic package. Discontinuous Current Mode (DCM) Power Factor Correction (PFC)

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Rev. 01 4 February 2010 Product data sheet 1. Product profile 1.1 General description Ultrafast epitaxial rectifier diode in a SOT226 (I2PAK) plastic package 1.2 Features and benefits Fast switching High thermal cycling performance Low forward voltage drop Low on-state losses Low profile package facilitating compact designs Low thermal resistance Soft recovery minimizes power-consuming oscillations 1.3 Applications Discontinuous Current Mode (DCM) Power Factor Correction (PFC) Output rectifiers in high-frequency switched-mode power supplies 1.4 Quick reference data Table 1. Quick reference Symbol Parameter Conditions Min Typ Max Unit V RRM repetitive peak reverse - - 600 V voltage I F(AV) average forward current square-wave pulse; δ = 0.5; T mb 123 C; see Figure 1 and 2 - - 9 A I FRM repetitive peak forward t p = 25 µs; δ = 0.5 - - 18 A current Dynamic characteristics t rr reverse recovery time I F =1A; V R =30V; di F /dt = 100 A/µs; T j = 25 C; see Figure 5-50 60 ns Static characteristics V F forward voltage I F =8A; T j =150 C; see Figure 4-0.97 1.11 V

2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 n.c. no connection 2 K cathode 3 A anode mb K mounting base; cathode 2 1 3 003aad550 3. Ordering information 1 2 3 SOT226A (I2PAK) Table 3. Ordering information Type number Package Name Description Version I2PAK plastic single-ended package (I2PAK); TO-262 SOT226A 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V RRM repetitive peak reverse - 600 V voltage V RWM crest working reverse - 600 V voltage V R reverse voltage DC - 600 V I F(AV) average forward current non-repetitive peak forward current square-wave pulse; δ = 0.5; T mb 123 C; see Figure 1 and 2-9 A I FSM t p = 8.3 ms; sine-wave pulse; T j(init) =25 C - 77 A t p = 10 ms; sine-wave pulse; T j(init) =25 C - 70 A T stg storage temperature -40 150 C T j junction temperature - 150 C I FRM repetitive peak forward current t p = 25 µs; δ =0.5-18 A _1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 4 February 2010 2 of 11

20 P tot (W) 15 0.5 003aab480 δ = 1 12 P tot (W) 10 8 4.0 2.8 2.2 1.9 003aab481 a = 1.57 10 0.2 6 5 0.1 4 2 0 0 5 10 15 I F(AV) (A) 0 0 3 6 9 I F(AV) (A) Fig 1. Forward power dissipation as a function of average forward current; square waveform; maximum values Fig 2. Forward power dissipation as a function of average forward current; sinusoidal waveform; maximum values _1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 4 February 2010 3 of 11

5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R th(j-mb) thermal resistance from junction with heatsink compound; see Figure 3 - - 2.5 K/W to mounting base R th(j-a) thermal resistance from junction to ambient free air - 60 - K/W 10 Z th(j-mb) (K/W) 1 001aag913 10 1 P t p δ = T 10 2 t p t T 10 3 10 6 10 5 10 4 10 3 10 2 10 1 1 10 t p (s) Fig 3. Transient thermal impedance from junction to mounting base as a function of pulse width _1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 4 February 2010 4 of 11

6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics V F forward voltage I F =8A; T j =25 C; see Figure 4-1.12 1.25 V I F =20A; T j =25 C; see Figure 4-1.31 1.45 V I F =8A; T j = 150 C; see Figure 4-0.97 1.11 V I R reverse current V R =600V - 2 50 µa V R =600V; T j = 100 C - 0.1 0.35 ma Dynamic characteristics Q r recovered charge I F =2A; V R =30V; di F /dt = 20 A/µs; - 40 70 nc see Figure 5 t rr reverse recovery time I F =1A; V R =30V; di F /dt = 100 A/µs; T j =25 C; see Figure 5-50 60 ns I RM peak reverse recovery current I F =10A; V R =30V; di F /dt = 50 A/µs; see Figure 5-3 5.5 A V FR forward recovery voltage I F =10A; di F /dt = 10 A/µs; see Figure 6-3.2 - V I F (A) 25 003aab482 I F dl F dt 20 t rr 15 time 10 25 % (1) (2) (3) Q r 100 % 5 I R I RM 0 0 0.4 0.8 1.2 1.6 V F (V) 003aac562 Fig 4. Forward current as a function of forward voltage Fig 5. Reverse recovery definitions; ramp recovery _1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 4 February 2010 5 of 11

10 4 003aab912 C (pf) C iss 10 3 C oss C rss 10 2 10 1 1 10 10 2 V DS (V) Fig 6. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values _1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 4 February 2010 6 of 11

7. Package outline Plastic single-ended package (I2PAK); low-profile 3-lead TO-262 SOT226A A E A 1 D 1 D L 1 Q b 1 b 2 L 1 2 3 b c e e Dimensions 0 5 10 mm scale Unit A A 1 b b 1 b 2 c D D 1 E e L L 1 Q mm max nom min 4.7 4.3 1.40 1.15 0.95 0.70 1.40 1.14 1.7 1.3 0.65 0.45 9.4 8.6 1.32 1.02 10.30 9.65 2.54 (REF) 15.0 12.5 3.0 (REF) 2.6 2.2 sot226a_po Outline version SOT226A References IEC JEDEC JEITA TO-262 European projection Issue date 09-08-17 09-08-25 Fig 7. Package outline SOT226A (I2PAK) _1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 4 February 2010 7 of 11

8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes _1 20100204 Product data sheet - - _1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 4 February 2010 8 of 11

9. Legal information 9.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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In no event shall be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of. Right to make changes reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 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Applications Applications that are described herein for any of these products are for illustrative purposes only. makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer s third party customer(s) (hereinafter both referred to as Application ). It is customer s sole responsibility to check whether the product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. does not accept any liability in this respect. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. hereby expressly objects to applying the customer s general terms and conditions with regard to the purchase of products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. _1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 4 February 2010 9 of 11

Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products Unless the data sheet of an NXP Semiconductors product expressly states that the product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors specifications such use shall be solely at customer s own risk, and (c) customer fully indemnifies for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond standard warranty and product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com _1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 4 February 2010 10 of 11

11. Contents 1 Product profile...........................1 1.1 General description......................1 1.2 Features and benefits.....................1 1.3 Applications............................1 1.4 Quick reference data.....................1 2 Pinning information.......................2 3 Ordering information......................2 4 Limiting values...........................2 5 Thermal characteristics...................4 6 Characteristics...........................5 7 Package outline..........................7 8 Revision history..........................8 9 Legal information.........................9 9.1 Data sheet status........................9 9.2 Definitions..............................9 9.3 Disclaimers.............................9 9.4 Trademarks............................10 10 Contact information......................10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 4 February 2010 Document identifier: _1