(Year ended March 31, 2014) May 16, 2014 FY2013 CONSOLIDATED RESULTS

Transcription

1 (Year ended March 31, 2014) May 16,

2 Consolidated Results Summary Business Results for FY2013 Ended March 31, 2014 Forecast for FY2014 Ending March 31, 2015 Measures of FY2014 Ending March 31,

3 Business Results for FY2013 Ended March 31,

4 Consolidated Statements of Income ( million) FY2012 FY2013 Changes Net Sales 11,350 7, % Cost of Sales 8,633 5, % Gross Profit 2,716 2, % Selling, General and Administrative Expenses 5,274 6, % Experiment and Research Expenses 2,033 2, % Operating Income (Loss) -2,558-4,113 - Non-Operating Income % Dividend Income % Subsidy Income % Non-Operating Expenses Ordinary Income (Loss) -2,051-3,909 - Extraordinary Income 10 1,467 - Gain on Sales of Investment Securities Extraordinary Loss 16 1,859 - Impairment Loss - 1,503 - Premium Allowance of Retirement Net Income (Loss) -2,120-4,312 - Orders Received 10,139 8, % 4

5 R&D Expenses, Capital Expenditures and Depreciation ( million) ( million) , ,500 2,000 1,921 2,033 2, ,500 1,420 1, , /3 2011/3 2012/3 2013/3 2014/ /3 2011/3 2012/3 2013/3 2014/3 5 Capital Expenditures Depreciation

6 Consolidated Balance Sheets ( million) FY2012 FY2013 Increase Total Current Assets 19,105 16,645-2,460 Cash and Deposits 9,845 9, Merchandise and Finished Goods 3,603 2, Other 1, ,368 Total Noncurrent Assets 11,899 9,414-2,485 Buildings and Structures 1,357 2, Land 4,929 3,540-1,389 Investment Securities 4,597 2,526-2,072 Total Assets 31,004 26,059-4,945 Total Current Liabilities Accounts Payable-trade Total Noncurrent Liabilities 1,084 1, Deferred Tax Liabilities Total Liabilities 2,037 1, Total Net Assets 28,967 24,402-4,565 Retained Earnings 13,768 9,287-4,480 Total Liabilities and Net Assets 31,004 26,059-4,945 6

7 Consolidated Cash Flows ( million) FY2012 FY2013 Increase Cash Flows from Operating Activities 2,225-2,774-4,999 Loss before Income Taxes and Minority Interests -2,057-4,302-2,245 Depreciation Impairment Loss - 1,503 1,503 Cash Flows from Investing Activities -1,794 1,799 3,593 Purchase of Property, Plant and Equipment Proceeds from Sales of Investment Securities - 2,263 2,263 Cash Flows from Financing Activities Cash Dividends Paid Net Increase (Decrease) in Cash and Cash Equivalents Increase in Cash and Cash Equivalents from Newly Consolidated Subsidiary , Cash and Cash Equivalents at End of Period 9,253 8,

8 Quarterly Orders Received and Net Sales ( million) 7,000 6,000 5,000 5,880 5,049 4,000 3,000 2,000 1,000 2,054 3,277 1,271 2, ,906 1,728 2,348 2,168 1,823 1,488 2,166 1, Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 8 Orders Received Net Sales

9 Sales Breakdown by Product Type Other Equipments 6.0% Spare Parts 8.5% Other Equipments 4.3% Spare Parts 15.6% Die Bonder 30.2% Wire Bonder 55.2% Die Bonder 16.0% Wire Bonder 64.1% 9

10 Sales Breakdown by Region China 14.8% Taiwan 5.9% Others 0.1% Others in Asia 12.5% Japan 23.1% South Korea 43.5% China 22.1% Others 0.3% Others in Asia 16.5% Taiwan 15.5% Japan 20.3% South Korea 25.4% 10

11 Forecast for FY2014 Ending March 31,

12 Semiconductor and Bonder Market (Worldwide) 450,000 4, ,000 Result Forecast 4, ,000 3, ,000 3, ,000 2, ,000 2, ,000 1, ,000 1,000 50, ($ million) Semiconductor Market (Scale on Left) Bonder Market (Scale on Right) 0 ($ million) Required Disclaimer: The Gartner Report(s) described herein, (the Gartner Report(s) ) represent(s) data, research opinion or viewpoints published, as part of a syndicated Subscription service, by Gartner, Inc. ( Gartner ), and are not representations of fact. Each Gartner Report speaks as of its original publication date (and not as of the date of this enterprise report) and the opinions expressed in the Gartner Report(s) are subject to change without notice. 12 Source: Gartner, Forecast: Semiconductor Manufacturing Equipment, Worldwide, 1Q14 Update Bob Johnson et al. 22 April 2014 Chart created by Shinkawa based on Gartner data.

13 Wire Bonder and Die Bonder Market (Worldwide) 1,600 Result Forecast 1,400 1,200 1, ($ million) Wire Bonder Die Bonder 13 Source: Gartner, Forecast: Semiconductor Manufacturing Equipment, Worldwide, 1Q14 Update Bob Johnson et al. 22 April 2014 Chart created by Shinkawa based on Gartner data.

14 Flip Chip Bonder Market (Worldwide) Result Forecast ($ million) 14 Source: Gartner, Forecast: Semiconductor Manufacturing Equipment, Worldwide, 1Q14 Update Bob Johnson et al. 22 April 2014 Chart created by Shinkawa based on Gartner data.

15 Forecast for FY2014 Q1 ( million) FY2013 Q1 FY2014 Q1 Changes Net Sales 1,728 2, % Operating Income (loss) Ordinary Income (loss) Net Income (loss) Orders Received 2, *Assumed Exchange Rate : 100 yen / U.S. dollar

16 Measures of FY2014 Ending March 31,

17 Improve Company Structure Enhance Product Planning Capability Increase Profitability Strengthen Global Business Operation 17

18 Enhance Product Planning Capability Group / Team System Organization Promoting Projects Optimizing Development Process Academic / Industry Partnerships Joint Development with Customer Product Development to Meet Market Demands 18

19 Increase Profitability Japanese Factory Production for High-Value-Added Products Thai Factory Production for Volume Production Establishing Optimal Location Production Sharing Core Units Shortening Lead Time Factory Inventory Optimization 19

20 Strengthen Global Business Operation Head Office Sales Div. Factory Reform of Commercial Distribution USA Japan Shanghai SGR Thai Korea Taiwan Head Office Sales Div. Customer Product Planning Sales Policy Support Activities Japan SGR Korea USA Shanghai Thai Taiwan 20 Customer Factory 2014 年 3 月期決算説明会

21 Business Expansion According to Models 21

22 Wire Bonder Obtaining Qualification from Customer in Progress! Alliance with Material Manufacturers Strengthen Production Support Function UTC-5000 Series Improvement in Functionality of the UTC Series Embark on a Sales Drive in the Market for Extending Business 22

23 Die Bonder STC-500 for Discrete STC-800 Released in March 2014 SPA-800LED Enhancing Product Lineup New Model for IC SPA-400 for IC Planning to bring to market in FY

24 Flip Chip Bonder Volume production outlook of flip chip products through TCB process Source: Internal Research LFB-1102Super LFB-2301 Continuing R&D for the Upcoming Volume Production Stage 24

25 SHASHI (excerpt) Corporate Mission Shinkawa leads in robot technology to contribute to society which allows the human being to be more creative. Action Philosophy Challenge Change Collaboration 25

26 Cautionary Statement This presentation sheets contain forward-looking statements that reflect management s views and assumptions based on the information currently available with respect to certain future events including earning forecast, business strategies and prospect. Actual results may differ materially from those statements due to changes in various factors, thus the events and results of such forward-looking assumptions cannot be assured. Any forward-looking statements speak only as of the date of this presentation sheets, and SHINKAWA assumes no duty to update such statements. The factors that may cause actual results to differ materially from those predicted by such forward-looking statements include, but are not limited to, unanticipated changes in demand for SHINKAWA s products owing to changes in the economic conditions in SHINKAWA s markets, changes in exchange rates, the impact of changes in regulations, accounting principles and practices. Corporate Planning Dept. SHINKAWA LTD. TEL: FAX: