Q2 FY2018 (July - September 2017) Financial Announcement

Transcription

1 FY218 (July - September 217) Financial Announcement October 31, 217 Agenda: FY218 Consolidated Financial Summary Tetsuro Hori, Representative Director, CFO, Executive Vice President Business Environment and Financial Estimates Toshiki Kawai, Representative Director, President & CEO CORP IR / October 31, 217 1

2 Forward Looking Statements Disclaimer regarding forward-looking statement Forecast of TEL s performance and future prospects and other sort of information published are made based on information available at the time of publication. Actual performance and results may differ significantly from the forecast described here due to changes in various external and internal factors, including the economic situation, semiconductor/fpd market conditions, intensification of sales competition, safety and product quality management, and intellectual property-related risks. Processing of numbers For the amount listed, because fractions are rounded down, there may be the cases where the total for certain account titles does not correspond to the sum of the respective figures for account titles. Percentages are calculated using full amounts, before rounding. Exchange Risk In principle, export sales of Tokyo Electron s mainstay semiconductor and FPD panel production equipment are denominated in yen. While some settlements are denominated in dollars, exchange risk is hedged as forward exchange contracts are made individually at the time of booking. Accordingly, the effect of exchange rates on profits is negligible. FPD: Flat panel display CORP IR / October 31, 217 2

3 FY218 Consolidated Financial Summary October 31, 217 Tetsuro Hori Representative Director, CFO, Executive Vice President CORP IR / October 31, 217 3

4 FY218 (July - September) Highlights Record high sales of 28.5 billion yen (QoQ+19%) Approx. 6% of SPE new equipment sales for memory FS business sales 64.4 billion yen, up 18% QoQ Solid increase in profit margins Operating margin new record high of 24.4% (+1.2pts QoQ) FPD segment profit margin improving as planned Raised full year sales and profit estimates based on buoyant semiconductor demand SPE: Semiconductor production equipment, FS: Field solutions, FPD: Flat panel display production equipment CORP IR / October 31, 217 4

5 4 Financial Summary (Billion yen) FY217 FY218 Q3 Q4 Q1 vs. Q1 FY218 Net sales % Gross profit Gross profit margin % % % % % +21.7% +1.pts SG&A expenses % Operating income Operating margin % % % % % +25.1% +1.2pts Income before income taxes % Net income attributable to owners of parent % R&D expenses % Capital expenditures % Depreciation and amortization % 1. In principle, export sales of Tokyo Electron s mainstay semiconductor and FPD production equipment are denominated in yen. While some settlements are denominated in dollars, exchange risk is hedged as forward exchange contracts are made individually at the time of booking. 2. Profit ratios are calculated using full amounts, before rounding. CORP IR / October 31, 217 5

6 Financial Performance % % 4% 15 3% % % FY 17 Q3 Q4 Q1 FY 18 Net sales Operating income Net income attributable to owners of parent Gross profit margin 39.7% 39.1% 42.5% 41.1% 42.1% Operating margin 18.5% 18.3% 23.6% 23.2% 24.4% Gross margin maintained at high level, new record high operating margin CORP IR / October 31, %

7 Segment Information SPE (Semiconductor production equipment) 3 25 Sales Segment income Segment profit margin % 5% FPD (Flat panel display production equipment) 3 25 Sales Segment income Segment profit margin 6% 5% 1% Composition of Net Sales Others FPD % % % 24.2% 27.8% FY' % 29.6% Q3 Q4 Q1 FY' % 2% 1% % % 7.1% FY' % %.4 Q3 Q4 Q1 FY' % 2.2 3% 2% 1% % 5% % FY'17 Q3 Q4 Q1 FY'18 SPE 1. Segment income is based on income before income taxes. 2. R&D expenses such as fundamental research and element research are not included in above reportable segments. 3. Composition of net sales figures is based on the sales to customers. CORP IR / October 31, 217 7

8 SPE Division: Sales by Region FY 16 Q3 Q4 Q1 FY 17 Q3 Q4 Q1 FY 18 Japan North America Europe South Korea Taiwan China S. E. Asia, Others CORP IR / October 31, 217 8

9 SPE Division: New Equipment Sales by Application 25 DRAM Non-volatile memory Logic Foundry Logic & others (MPU, AP, Others) % 29% 2% 2% 3% 3% 21% FY' % 25% 23% 23% 27% 27% 25% 38% 38% 17% 17% 22% 22% 23% 18% % 31% 31% 32% 32% 19% Q3 Q4 Q1 FY'17 Increase in DRAM sales to Korea and Taiwan and logic to Korea and US, decline in Taiwan foundry CORP IR / October 31, 217 Percentages on the graph show the composition ratio of new equipment sales. Field solutions sales are not included. 9 12% % 31% 31% 32% 32% 25% 16% % 24% 24% 34% 34% 26% 22% % 27% 27% 27% 27% 24% 17% % 4% 4% 16% 16% 27% Q3 Q4 Q1 FY' % 35% 8% 32%

10 Field Solutions Sales FY 16 Q3 Q4 Q1 FY 17 Q3 Q4 Q1 FY 18 SPE Sales FPD Sales CORP IR / October 31, 217 1

11 Balance Sheet Assets Liabilities & Net Assets , Cash & cash equivalents* Trade notes, accounts receivables , Liabilities FY'17 Q3 Q4 Q1 FY'18 Inventories Other current assets Tangible assets Intangible assets Investment & other assets FY' Q3 Q4 Q1 FY' Net assets * Cash and cash equivalents: Cash and deposits + Short-term investments, etc. (Securities in B/S). CORP IR / October 31,

12 Inventory Turnover and Accounts Receivable Turnover (Days) Net Sales Inventory Turnover Accounts Receivable turnover FY'16 Q3 Q4 Q1 FY'17 Q3 Q4 Q1 FY'18 Turnover days = inventory or accounts receivable at the end of each quarter / last 12 months sales x 365 CORP IR / October 31,

13 Cash Flow Share Repurchase FY 16 Q3 Q4 Q1 FY 17 Q3 Q4 Q1 FY 18 Cash flow from operating activities Cash flow from investing activities* Cash flow from financing activities Free cash flow** Cash on hand*** * Cash flow from investing activities excludes changes in deposits with periods to maturity of over 3 months. ** Free cash flow = cash flow from operating activities + cash flow from investing activities excluding changes in deposits with peri ods to maturity of over 3 months. *** Cash on hand includes the total of cash + deposits with periods to maturity of over 3 months. CORP IR / October 31,

14 Business Environment and Financial Estimates Revisions October 31, 217 Toshiki Kawai Representative Director, President & CEO CORP IR / October 31,

15 Wafer Fab Equipment (WFE) Market Outlook Future growth drivers PC, internet, mobile + VR/AR *, IoT, AI **, machine learning, big data, autonomous driving, personalized medicine * VR/AR: Virtual reality/augmented reality ** AI: Artificial intelligence ($ Billion) WFE market growth accelerating. Ongoing investment of $45B+ Expanding investment in both advanced logic and memory CY'13 CY'14 CY'15 CY'16 CY'17 CY'18 Equipment market will move to the next phase amid expanding applications for semiconductors CORP IR / October 31, 217 Source: VLSI Chip Market Research Services Equipment Database, 3Q17 Update October Graph created by TEL using above data 15 Equipment for w afer-level packaging is not included in the market size here.

16 Business Environment (Outlook as of October 217) WFE * Capex CY217 investment driven by buoyant demand for 3D NAND and DRAM, expect YoY growth of approx. 25%. For CY218 we expect continued investment above the level seen in CY217. FPD production equipment capex for TFT array process ** We expect CY217 investment in production equipment increase of approx. 3% YoY with demand driven by continued investment in small/medium panels for mobile and startup of G1.5. For CY218 we expect further growth of 2%+ due to expanded investment in G1.5. Accelerating growth in the equipment market on active investment in IoT and next generation technologies * WFE (Wafer fab equipment): The semiconductor production process is divided into front-end production, in which circuits are formed on wafers and inspected, and back-end production, in which wafers are cut into chips, assembled and inspected again. Wafer fab equipment refers to the production equipment used in front-end production and in wafer-level packaging production. ** TFT array process: The processes of manufacturing the substrates with the electric circuit functions that drive displays CORP IR / October 31,

17 CY217 Market Growth and Business Opportunities by Application NAND: Market growth of 5% YoY forecast Capex: 6X/7X generations to comprise 7% Driving force: Growth in SSD demand for data centers Opportunity: Differentiation through high value-added etch DRAM: Increase of 5% Capex: Capex for 1Xnm generation to comprise 6% (1k/wspm) Driving force: Average mobile device capacity up 25% YoY, server capacity up 4% Opportunity: Differentiation through combined patterning and our strength in interconnects Logic/Foundry: Same level forecast Capex: 1/7nm generation to comprise 7% Driving force: Demand for higher performance, lower power consumption Opportunity: Business expansion in more complex patterning processes D NAND production capacity TEL estimate 35 7 CY'15 CY'16 CY'17 CY'18 CY'19 year-end CORP IR / October 31,

18 FY218 SPE Business Progress Expect share to grow in all three key equipment fields (etch, deposition, clean) Differentiation through high value-added equipment for next generation technology Full year sales for memory expected to double YoY on increased investment and market share growth Etch system (3D NAND: multi-level contact/word line isolation, DRAM: patterning/interconnects) Deposition system (3D NAND: memory hole film stack) Cleaning system (3D NAND: dummy word line removal, DRAM: metal recess etch) Multi-cell test system(high speed test for 3D NAND) 3D NAND Multi-level contact Word line isolation dummy word line removal Plasma Etch System Tactras Atomic Layer Deposition System NT333 Auto Wet Station EXPEDIUS -i Multi-Cell Test System Cellcia SPE business strategy progressing as planned, growing share with technology for next generation CORP IR / October 31,

19 FY218 FPD Business Progress Establishing our leading position in G1.5 Introduced new Betelex platform etch equipment Expansion of PICP * etch system going well Full year small/medium panel sales expected to approx. double YoY, captured large panel business too FPD Coater/Developer Exceliner FPD Etch/Ash System Impressio FPD Etch/Ash System Betelex FPD business strategy is proceeding well, expect profit ratio to increase according to plan CORP IR / October 31, * PICP: Plasma source for producing extremely uniform high density plasma on substrate

20 FY218 Financial Estimates CORP IR / October 31, 217 2

21 Revision of FY218 Financial Estimates FY217 (Actual) FY218 (Estimates) 1 st half 2 nd half Full year Actual New estimates New estimates Adjustments* Adjustments* Full year YoY change Net sales , % SPE , % FPD % Gross profit Gross profit margin % % % pts % pts pts SG&A expenses Operating income Operating margin % % % pts % pts pts Income before income taxes Net income attributable to owners of parent (Billion yen) Net income per share (Yen) , Large upward revision of full-year financial estimates due to expanding customer investment and increase in market share CORP IR / October 31, 217 *Adjustments:changes from the figures announced on April 28, SPE: Semiconductor production equipment, FPD: Flat panel display production equipment

22 FY218 SPE Division New Equipment Sales Forecast (Billion yen) Sales by application DRAM Logic foundry Non-volatile memory Logic & others % 22% 4% 37% DRAM Sharp increase in investment on tight supply 3D NAND Strong demand for SSD, greater than expected increase in investment Begin supplying equipment for next 9X generation 1 11% 3% FY218 (Actual) 1% 25% FY218 H2 (Estimates) Logic/Foundry Continue investment in 1/7nm generation Firm investment in 28nm and above generation too CORP IR / October 31, 217 Percentages on the graph show the composition ratio of new equipment sales. Field solutions sales are not included. 22

23 R&D Expenses, Capex Plan R&D Expenses 94.B 1.B Continue investing based on focus areas and sustainable growth Capex 42.B 5.B Actively invest in advanced technologies R&D and to meet increasing production Depreciation 24.B 23.B R&D expenses Capex Depreciation FY'14 FY'15 FY'16 FY'17 FY'18(E) FY'14 FY'15 FY'16 FY'17 FY'18(E) Plan to conduct proactive upfront investment towards a new phase in the equipment market CORP IR / October 31,

24 FY218 Dividend Forecast (Yen) yen 143 yen Dividend per share 237 yen 352 yen 65 yen Year-end 328 yen Interim 277 yen FY214 FY215 FY216 FY217 FY218(E) TEL shareholder return policy Dividend payout ratio: 5% Annual DPS of not less than 15 yen We will review our dividend policy if the company does not generate net income for two consecutive fiscal years We will flexibly consider share buybacks Expect to raise DPS more than 7% YoY CORP IR / October 31,

25 Appendix CORP IR / October 31,

26 FY218 (April-September 217) Highlights Record high sales of billion yen (up 47% YoY) SPE new equipment sales for memory doubled FS business sales up 23% to billion yen Solid increase in profit margins Gross margin up 2.4pts to 41.7% Operating margin new record high of 23.9% (+6.9pts YoY). Medium-term target of 24%-26% now in sight Raised full year sales and profit estimates based on buoyant semiconductor demand SPE: Semiconductor production equipment, FS: Field solutions CORP IR / October 31,

27 Financial Summary FY217 FY218 H2 YoY Change (Reference) FY218 estimates announced on Apr. 28 Net sales % 48. Gross profit Gross profit margin % % % +55.3% +2.4pts % SG&A expenses % 98. Operating income Operating margin % % % 15.5% +6.9pts % Income before income taxes % 14. Net income attributable to owners of parent % 79. R&D expenses % Capital expenditures % Depreciation and amortization % 1. In principle, export sales of Tokyo Electron s mainstay semiconductor and FPD production equipment are denominated in yen. While some settlements are denominated in dollars, exchange risk is hedged as forward exchange contracts are made individually at the time of booking. 2. Profit ratios are calculated using full amounts, before rounding. CORP IR / October 31,

28 Financial Performance 6 5% % 4% 4 3 3% % % FY 16 H2 FY 17 H2 FY 18 Net sales Operating income Net income attributable to owners of parent Gross profit margin 39.9% 4.6% 39.3% 41.1% 41.7% Operating margin 18.% 17.2% 17.% 21.4% 23.9% 1% CORP IR / October 31,

29 Segment Information SPE (Semiconductor production equipment) 5 Sales Segment income Segment profit margin % FPD (Flat panel display production equipment) 5 Sales Segment income Segment profit margin 5% 1% Composition of Net Sales Others FPD 4 4% 4 4% % 19.3% 21.9% % % % 2% 1% % % 6.8% 12.1% % 3% 2% 1% 5% SPE FY'16 H2 FY'17 H2 FY'18 % FY' H2 1.7 FY'17 H FY'18 % % FY'16 H2 FY'17 H2 FY'18 1. Segment income is based on income before income taxes. 2. R&D expenses such as fundamental research and element research are not included in above reportable segments. 3. Composition of net sales figures is based on the sales to customers. CORP IR / October 31,

30 Balance Sheet Assets Liabilities & Net Assets , , Cash & cash equivalents* Liabilities FY'16 H2 FY'17 H2 FY'18 Trade notes, accounts receivables Inventories Other current assets Tangible assets Intangible assets Investment & other assets FY'16 H2 FY' H FY'18 Net assets * Cash and cash equivalents: Cash and deposits + Short-term investments, etc. (Securities in B/S). CORP IR / October 31, 217 3

31 CORP IR / October 31,