# needed per macro ND KARCT-ND R29,R30 R Res. 330R, 5%, 0.1W, ARCT-ND ND

Size: px

Start display at page:

Download "# needed per macro ND KARCT-ND R29,R30 R Res. 330R, 5%, 0.1W, ARCT-ND ND"

Leon Perry
5 years ago
Views:

1 TI DESIGNS TIDM-2PHILPF Bill of Materials Item Macro Name Ref. Des Type Description MAIN BOARD H J 00 pin DIMM socket - Molex M2 M AuxSupply-400Vin-to-2V-5V LD LD2 U5,U0 LD LD U LED, red, LED, red, SN74LV2G7DBVR, IS BUFF DL SHMIT TRIG SOT236 R3,R32 R Res. 0K, 5%, 0.W, board Digikey Part # Mouser Part # Newark omments R0,R2 R Res. 2.2K, 5%, 0.W, ND 3-2.2KART-ND R29,R30 R Res. 330R, 5%, 0.W, ART-ND 4 5,7 d3, d7 BS,BS2,BS3,BS 4 J4 P AP FILM 0.047UF 760VD er. ap - 4.7nF, 6V, X7R, er. ap - 00nF, 50V, X7R, ND ND B Banana onnector and Screws ND JP TB M Standard 0.'' SIL headers, cut to fit, total needed x4 ONN A REEPT 7MM R/A RND PB Q28-ND ustom Made A

2 Item Macro Name Ref. Des Type Description board Digikey Part # Mouser Part # Newark omments PF-2PhIl-Shunt ,3 4 5,6, 6 9 AP ER 00PF 50V 5% NP0 AP FILM 0.047UF 630VD Elec. ap - 00uf, 450V, Alum, radial AP ER 0nF 50V 0% X7R ND ND ND ND d er. ap - 2u2, 25V, X7R, ND d2 AP ER 0UF 6V 0% X7R ND d3 er. ap- 330n, 6V, X5R, ND d5 er. ap - 22u, 6V, X5R, ND R,R2,R7,R R Res. - 0K, 5%, 0.W, KART-ND R3,R4,R5,R9 R Res. - 0R, 5%, 0.W, ART-ND R6,R8,R8 R Res OHM W % R0,R7 R Res. - 20K, %, /8W, 2 2 RA252-FZ- R050ELFT-ND KRT-ND R3,R4 R Res. - M, %, 0.W, MRT-ND R5 R Res K, %, 0.W, 3-3.0KRT-ND R2,R6 R Res. - 2K, %, 0.W, KRT-ND R9 R Res. - 00R, 5%, 0.W, PR PR DNP 0 0 ZD ZD DIODE ZENER 500MW 6V SOD ND

3 PwrEntry HS,HS2 L,L2 HS L Heat Sink, 2.0'', Wakefield, Outline 34.92mm x 2.70mm, Height 2'' Nylon Washers for Heatsink Stad offs, 0.20x0.375 Nylon board Digikey Part # Mouser Part # Newark omments ND K Heat Pads Insulators 0 0 BER205-ND INDUTOR TX R OOPER BUSSMAN Item Macro Name Ref. Des Type Description 34 DIODE ZENER 500MW 5.V ZD2 ZD SOD ND 35 Dual Power Mosfet Driver HS, U U 4A, 8-SOI, U27524DR, ND 36 U2 U Amplifier, OPA365, SOT ND 37 MOSFET N-H 650V 2A TO- Q,Q2 Q IPP60R250PIN-ND 38 RETIFIER 6A 600V P600 D DA AXIAL GI756-E3/54GIT-ND 39 DIODE SHOTTKY 30V 0.5A D2,D3 DA SOD MBR0530T-ND 40 3D0060G, DIODE SHOTTKY D4,D5 DA 600V 0A TO D0060G-ND 595- OPA365AIDBVT R4526 avail. thru alliedelec.com er. ap - 22u, 6V, X5R, er. ap - 0u, 25V, X5R, er. ap - 4u7, 25V, X5R, er. ap - 0.uf, 25V, X5R, 5,6,7 Elec. ap - 330uf, 25V, Alum, 3 3 radial R R Res R, %, 0.W, R2 R Res R, 5%, 0.W, LD LD LED, green, ND ND ND ND P5542-ND 3-330RT-ND 3-470RT-ND L605T-ND

4 Item Macro Name Ref. Des Type Description board Digikey Part # Mouser Part # Newark omments 53 SW SW Toggle Switch - Miniature, SPDT 08-2AST203- EVX 54 Power Module - PTH08080 M P ND 55 U U LDO - 3.3V - TPS ND 56 J Standard 0." SIL headers, cut to fit, total needed x2 57 JP JP Power jack 2. x 5.5 mm P-002AH-ND A-PwrEntry ,2 3,4,5,6 7,8 AP FILM 4700PF 250VA P4625-ND AP ER 2200PF 250V 0% X7R ND AP ER 3900PF 50V 5% NP ND R,R2,R4,R5 R Res K, %, /4W, 206 R3,R6 R Res K, %,/8W, 2 2 R7,R8 R Res - 2M, %,/4W, KRT-ND F F Fuse Holder ND Fuse-ap Fuse-F RT F F RT VAR VAR D,D2 DA Fuse ap for 5x20mm fuses flush mount FUSE 250V IE SLO 5X20MM 0A URRENT LIMITR INRSH 0 OHM 5A VARISTOR 275V RMS 0MM DIODE SHOTTKY 30V 200MA SOT-23 DB DB RET BRIDGE 5A 600V Lcm L 85-R, HOKE OMM MODE W/HDR.2mH 6A WK6234-ND F2425-ND ND ND 2 2 BAT54SFST-ND MB56W-BPMS-ND M890-ND

5 Item Macro Name Ref. Des Type Description 72 Spacers eramic/nylon spacers for the rectifier DB, 3mm inner dia, /4 inch or /8 inch height 4 4 board Digikey Part # Mouser Part # Newark omments 876K-ND, 875K-ND HS HS L, L2 L Heat Sink for the Diode bridge, Manufacturer - oolinnovation INDUT PWR 7.8UH TH, PA043L oolinnovation P/N 3-22P3M ND

6 IMPORTANT NOTIE FOR TI REFERENE DESIGNS Texas Instruments Incorporated ("TI") reference designs are solely intended to assist designers ( Buyers ) who are developing systems that incorporate TI semiconductor products (also referred to herein as components ). Buyer understands and agrees that Buyer remains responsible for using its independent analysis, evaluation and judgment in designing Buyer s systems and products. TI reference designs have been created using standard laboratory conditions and engineering practices. TI has not conducted any testing other than that specifically described in the published documentation for a particular reference design. TI may make corrections, enhancements, improvements and other changes to its reference designs. Buyers are authorized to use TI reference designs with the TI component(s) identified in each particular reference design and to modify the reference design in the development of their end products. HOWEVER, NO OTHER LIENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLETUAL PROPERTY RIGHT, AND NO LIENSE TO ANY THIRD PARTY TEHNOLOGY OR INTELLETUAL PROPERTY RIGHT, IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual proty right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual proty of the third party, or a license from TI under the patents or other intellectual proty of TI. TI REFERENE DESIGNS ARE PROVIDED "AS IS". TI MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THE REFERENE DESIGNS OR USE OF THE REFERENE DESIGNS, EXPRESS, IMPLIED OR STATUTORY, INLUDING AURAY OR OMPLETENESS. TI DISLAIMS ANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERHANTABILITY, FITNESS FOR A PARTIULAR PURPOSE, QUIET ENJOYMENT, QUIET POSSESSION, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLETUAL PROPERTY RIGHTS WITH REGARD TO TI REFERENE DESIGNS OR USE THEREOF. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY BUYERS AGAINST ANY THIRD PARTY INFRINGEMENT LAIM THAT RELATES TO OR IS BASED ON A OMBINATION OF OMPONENTS PROVIDED IN A TI REFERENE DESIGN. IN NO EVENT SHALL TI BE LIABLE FOR ANY ATUAL, SPEIAL, INIDENTAL, ONSEQUENTIAL OR INDIRET DAMAGES, HOWEVER AUSED, ON ANY THEORY OF LIABILITY AND WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUH DAMAGES, ARISING IN ANY WAY OUT OF TI REFERENE DESIGNS OR BUYER S USE OF TI REFERENE DESIGNS. TI reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services JESD46, latest issue, and to discontinue any product or service JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants formance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI s terms and conditions of sale of semiconductor products. Testing and other quality control techniques for TI components are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily formed. TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and oating safeguards. Reproduction of significant portions of TI information in TI data books, data sheets or reference designs is missible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary extise to create and implement safeguards that anticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in Buyer s safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA lass III (or similar life-critical medical equipment) unless authorized officers of the parties have executed an agreement specifically governing such use. Only those TI components that TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components that have not been so designated is solely at Buyer's risk, and Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS6949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS6949. Mailing Address: Texas Instruments, Post Office Box , Dallas, Texas opyright 204, Texas Instruments Incorporated

TI Designs: C2000 Solar DC/DC Converter with MPPT

TI Designs: C2000 Solar DC/DC Converter with MPPT IMPORTANT NOTICE FOR TI REFERENCE DESIGNS Texas Instruments Incorporated ("TI") reference designs are solely intended to assist designers ( Buyers ) who are developing systems that incorporate TI semiconductor